Electronics Forum | Mon Feb 13 10:41:14 EST 2017 | dyoungquist
Could be that your temperature ramp up rate is too fast. This could cause the flux in the solder paste to burn off too rapidly. When that happens, it can expand as it heats up and burns off, causing the solder to get spread out from the pad.
Electronics Forum | Sun Feb 12 22:52:20 EST 2017 | ltchsze
Hi fellow professionals, Wondering whether anyone has experience with solder splashing from component terminal. Have identified the source using the component without printing solder paste on PCB. Wondering the root-cause of the solder splashing fr
Electronics Forum | Fri Apr 10 13:25:08 EDT 2009 | jefflkupkt
Layer 2 is the ground plane layer of a 4 layer board. After installing a 2.5 mm DC power jack and 0.1 center SIP header by hand, the ground pin disconnects and causes an open. My board supplier said they passed Electrical Test. Prepreg was within
Electronics Forum | Fri Apr 10 18:51:39 EDT 2009 | boardhouse
Hi Jeff, Your board supplier could be correct in this way. The board could have had just a hair left of copper on the circuit, which would hold up under the electrical test process, but once you powered it up, then there was enough juice to burn th
Electronics Forum | Mon Apr 13 12:06:53 EDT 2009 | jefflkupkt
BoardHouse, Thanks for the reply. The board supplier did cover the cost of the bare boards. Five years ago I saw a different part pass ET only to fail at final assembly test as well. One engineer called it "acid trap" on the inner layers where the
Electronics Forum | Tue Feb 25 12:15:42 EST 2020 | dwl
Are you running a no clean process, or are you washing your PCBs? One caveat with ENIG is sometimes washing with hot DI water can effect solderability later on. I would also talk to your solder technicians and see what their preference is. Some pr
Electronics Forum | Thu Feb 27 16:23:37 EST 2020 | dwl
http://www.circuitnet.com/news/uploads/3/Comparing-Soldering-Results-of-ENIG-and-EPIG-Post-Steam-Exposure.pdf Years ago, I battled this problem. ENIG PCBs reflowed with active WS flux. We built one side, and then washed them because they were going
Electronics Forum | Mon Jun 12 22:00:51 EDT 2000 | Dave F
Could be. What are your profiles? 2) Au finish fail => Could be, but that the connections can be made with hand soldering makes this a low probability cause, assuming the activity of the flux used in hand soldering is not significantly different fr
Electronics Forum | Mon Aug 09 16:15:30 EDT 1999 | JohnW
| I am having cleaning problems when processing PCB's which have | TAIYO solder mask on them. After processing, hand soldering and | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc. Other soldermasks
Electronics Forum | Mon Aug 09 18:03:28 EDT 1999 | Earl Moon
| | I am having cleaning problems when processing PCB's which have | | TAIYO solder mask on them. After processing, hand soldering and | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc. Other solde
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