Electronics Forum | Wed Oct 14 01:17:40 EDT 2020 | SMTA-64386317
Data sheet allows of 250 DegC peak temperature and we are using below 240 DegC but still seeing high fal out. Manufacturer diagnose as BE charges loss due to heat. Hence, looking for anything extra could be done to minimize this defect. There is no w
Electronics Forum | Tue Apr 11 20:37:06 EDT 2000 | Dave F
Rich: Now that�s a great question!!! You�re corrrect. Primary-side temperature is the driver of the differences in the sensitivity to moisture between SMT and PTH devices that you�re finding. * Primary-side temperature for SMT ~= Secondary-side te
Electronics Forum | Tue Apr 29 12:12:46 EDT 2003 | jgregory
Chrissie, what type of equipment do you have? Is your tape PSA (pressure sensitive) or HSA (heat sensitive)? Jason
Electronics Forum | Mon Jul 15 00:31:34 EDT 2002 | ppcbs
If your just getting into BGA assembly or rework, I strongly suggest taking this class. It covers profiling and considerationds for heat sensitive BGA'sin depth. http://www.pcb-repair.com/bgarework.htm
Electronics Forum | Tue Jul 12 03:58:46 EDT 2005 | Chris Ong
Hi Bob, I heard that they have low temperature solder that is able to tackle heat sensitive component. Some of my industrial friend also mentioned that they some sort of low cost material alloy -SCS7?? Is that true? Thanks Chris
Electronics Forum | Wed May 24 17:09:05 EDT 2000 | Chris McDonald
We have A V-Tek using pressure sensitive cover tape but the only success that we have found is with SO-8, S0-14, SO-16 anything wider and the tape pulls apart when on our feeders. ANything over 16 wide is not recommened unless you get a heat sensitiv
Electronics Forum | Mon Feb 12 01:19:27 EST 2007 | Wayne
the center part of the BGA balls may not fully reflow or melt and cause BGA tilt, not functioning working (only press then work) and etc..... the simple way to solve this issue is to use low temperature solder paste, it can melt in between 220 to 225
Electronics Forum | Fri Mar 27 13:08:14 EDT 2015 | ppcbs
We reflow solder balls to the LGA using a tacky paste flux. Then we install the LGA to the PCB using a tacky paste flux. This will result in zero voiding and is a preferred method of our Military and Space clients. Be sure to read your spec sheet
Electronics Forum | Thu Apr 25 05:17:08 EDT 2019 | pdrirrework
Hello All, Using IR will mean that there is no minimum distance to the adjacent components as there is not hot air flow. If components are heat sensitive around the BGA you can also tape them off with a reflective tape. The IR heat will bounce strai
Electronics Forum | Wed Jan 09 09:31:53 EST 2008 | flipit
I solder LEDs everyday from 0402 sizes on up. I work for an optical company so every product I make has LEDs. Some products have hundreds of LEDs per circuit. The problem is that clear materials are not filled materials and thus don't have the adv
