Electronics Forum | Tue May 28 18:23:15 EDT 2019 | slthomas
TDK makes the CGA series "soft termination" caps. The p/n we use is CGA3E3X7S1A225K080AE, which will get you in the ball park for datasheets. We have moved to this to counter some variability in a heat staking machine (that we have yet to work out
Electronics Forum | Wed Sep 23 13:27:55 EDT 1998 | Dave F
All y'all, We use two methods to secure/stake jumper wires to boards: 1 Jumper wires that "magically" bond themselves when heated with a "U" shaped tip on a soldering iron. 2 Loctite 382 Tak Pak We use Tak Pak "99&44/100ths" more often than the "magi
Electronics Forum | Wed Sep 23 17:35:27 EDT 1998 | Chrys
| All y'all, | We use two methods to secure/stake jumper wires to boards: | 1 Jumper wires that "magically" bond themselves when heated with a "U" shaped tip on a soldering iron. | 2 Loctite 382 Tak Pak | We use Tak Pak "99&44/100ths" more often than
Electronics Forum | Thu Sep 24 07:37:32 EDT 1998 | Earl Moon
| | All y'all, | | We use two methods to secure/stake jumper wires to boards: | | 1 Jumper wires that "magically" bond themselves when heated with a "U" shaped tip on a soldering iron. | | 2 Loctite 382 Tak Pak | | We use Tak Pak "99&44/100ths" more
Electronics Forum | Thu Mar 12 21:14:16 EDT 2009 | davef
Mask: * I/O connector contact surfaces * Bus connector contact surfaces * Configuration jumper blocks * Test points * Surfaces that contact heat sinks (heat sinks are removed prior to coating) * Board mounting holes * Adjustable potentiometers * P
Electronics Forum | Tue Oct 04 20:31:16 EDT 2016 | davef
IPC-7721, Section 6.1, Jumper Wires, Jumper Wire Selection #5 states: "Recommended wire is solid, insulated, plated copper wire, 22 to 32 AWG with a heat resistant insulation. Wire with tin-lead plating may be restricted due to environmental laws."
Electronics Forum | Mon Jan 13 21:52:16 EST 2003 | davef
Haaaaaa!!!! You contractors get all the fun don't ya??? Consider: * Replacing the balls on the corners of the devices with balls composed of a "hard solder", yano something like 90/10. * Shimming to prevent excessive collapse of a heavy BGA during
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