Electronics Forum: hic 10% (Page 1 of 2)

5% color spot in HIC

Electronics Forum | Mon Jul 16 07:33:34 EDT 2012 | amitsindwani

Why to use 5% color spot in HIC if level 2a-5a are considered bad when 10% is NOT blue ? 10% will be NOT blue(or pink) only after 5% is pink. Then why to keep 5% in HIC ?

5% color spot in HIC

Electronics Forum | Mon Jul 16 16:37:29 EDT 2012 | kjs123p

Why to use 5% color spot in HIC if level 2a-5a > are considered bad when 10% is NOT blue ? 10% > will be NOT blue(or pink) only after 5% is pink. > Then why to keep 5% in HIC ? We change out the HIC and dessicant when the 5% turns pink to try to

Moisture Attraction Inside Moisture Barrier Bag

Electronics Forum | Mon Jul 12 20:26:10 EDT 2021 | stephendo

A test that I would like to see is, expose parts for 24 hours 40%-60% RH, 25C for 24 hours. Then seal with a HIC and minimum desiccant that Jstd 33 requires. Five to seven days later open and see if HIC says good but parts have excess moisture. I t

5% color spot in HIC

Electronics Forum | Tue Jul 17 00:10:32 EDT 2012 | amitsindwani

Referring to IPC/JEDEC J-STD-033B.1 section 3.3.2.2 'The amount of desiccant used, per moisture barrier bag, shall be based on the bag surface area and WVTR in order to limit the interior relative humidity in the MBB to less than 10% at 25°C.' So wha

FUJI part data sharing ( new parts only - BGA &CSP)

Electronics Forum | Mon Jan 23 10:06:17 EST 2006 | GCO

I would like to say sharing new parts only, it seems that we have a little problem teaching new BGA's or CSP's with actual vision system (very time consumming). - see FUJI site for an add-on off line unit if needed ($$$...HIC!). Any better solution o

5% color spot in HIC

Electronics Forum | Mon Jul 23 08:35:33 EDT 2012 | grahamcooper22

The lower the RH in the MBB the better for all moisture sensitive devices. Maintaining less then 5% will mean no parts of between 2a-5a MSL will need drying before use. The calculation uses 10% because it is a sensible amount of desiccant to use base

Moisture Sensitive Devices

Electronics Forum | Thu May 06 08:29:41 EDT 2004 | Christopher Lampron

10% RH) Do these stored components need baking before I use them now or not? * Depends on the MSD level (should be marked on packaging) Level 6 component need to be baked prior to asembly no matter what. Other levels should be OK if they were store

Re: adhesive for ptfe boards

Electronics Forum | Sat Oct 02 03:51:28 EDT 1999 | Brian

| | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | Many tahnks | | | Don't kno

Re: adhesive for ptfe boards

Electronics Forum | Mon Oct 04 04:37:57 EDT 1999 | Gian.D

| | | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | | Many tahnks | | | | |

Re: adhesive for ptfe boards

Electronics Forum | Wed Oct 06 08:49:36 EDT 1999 | Dave F

| | | | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | | | Many tahnks | |

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