Electronics Forum | Tue Mar 03 03:02:17 EST 2009 | emmanueldavid
25% out of Lands in PCB, Insufficient/Inconsistent Alloy deposition which causes for poor Tackiness between Device Spheres & Paste deposited. Also note that Aperture Opening Designs in Your Stencil draws a huge role for these defects. 4. Placement: P
Electronics Forum | Mon Mar 02 00:38:35 EST 2009 | sachu_70
Hi Jorge, The success of such production purely depends on process control. One needs to first understand the board layout in detail, and evaluate any critical components for their temperature handling capabilities. Remember, you are dealing with com
Electronics Forum | Thu Feb 26 17:04:41 EST 2009 | smt_guy
Zero Defect!
Electronics Forum | Sat Feb 28 16:40:05 EST 2009 | aj
A good SMT Engineer !
Electronics Forum | Fri Mar 06 09:04:37 EST 2009 | tech1
Ain't that the truth. The most underrated item on any production floor
Electronics Forum | Mon Mar 02 03:07:07 EST 2009 | lococost
I'm not a world class factory, but imo equipement wise, 3D paste inspection might be a thing for you to look into. grtz, Loco.
Electronics Forum | Mon Mar 02 08:25:08 EST 2009 | jorge_quijano
Thanx for all your recomendations, we already ask for a 3D SPI and help us well, we are asking for a ultrasonic stencil cleaner. By the way how do you deal with the 'head in pillow' defects? is there a solder paste alloy / profile issue?
Electronics Forum | Mon Feb 16 14:18:30 EST 2009 | jorge_quijano
1000 0402's, Micro BGA, QFP 0.4mm pitch, TSOP), we are trying to know what kind of equipment do you recommend to use in our factory, we already have Screen Printer, Chip shooters, Reflow oven, AOI, Stencil cleaner (manual), X ray, ICT... what else do
Electronics Forum | Mon Mar 02 10:23:46 EST 2009 | wrongway
You may need a glue despinser if you populate bottom side then wave. maybe a board deatacker at front of the line how about a multifunction pick and place machine so you can process all parts out there. we cleaned our stencils for years then we got a
Electronics Forum | Mon Mar 02 04:20:27 EST 2009 | emmanueldavid
Glossy/Matte & Plating). 2. Select Solder Paste according to Your Customer or In-House Specifications which is compatible for expected Process. 3. Use Chemical Etch / Electro Polished Stencil with proper Aspect Ratios (AR=>1.5) & Area Ratios(ArR=>0.6
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