Electronics Forum | Fri Sep 22 12:37:18 EDT 2000 | jonyoder
I am having problems with SMT electrolytic capacitors expanding and changing values after going through our reflow. The reflow profile we use includes temperatures of 200 deg C for 60 seconds and 230 deg C for 30 seconds. We need to use this profil
Electronics Forum | Wed May 09 10:40:10 EDT 2001 | davef
First, your primary side component pads should be designed according to SM-782A, "Surface Mount design & Land Pattern Standard". Next if you did that and your secondary side component pads are the same size as your primary side components, your diff
Electronics Forum | Fri May 21 18:32:53 EDT 2004 | Abe Froman
We have been using nitrogen in our reflow ovens for many years to reduce oxidation on our solder joints. Management is concerned about the high cost of nitrogen and have suggested we use hydrogen instead. I'm not sure if this is a good idea, but we
Electronics Forum | Tue Jun 11 11:25:57 EDT 2019 | don_julio
> If the board is just not reaching the temps you > need, you could place them in an oven to > "preheat" them. When I was building a > rather thick board with a copper core I had to do > this. Since we were only doing sma
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Wed Dec 10 13:26:03 EST 2014 | spoiltforchoice
I don't have one, but a lot of ovens of this vintage are on the market because they DO NOT cope well with lead free processes. There is one of these on eBay right now and it even says ROHS is right at the limit of what it can just about manage so thi
Electronics Forum | Fri Nov 25 05:16:44 EST 2016 | slavek
Hello, I want to ask on suitable temperature profile for PCBs with ENIG final surface finish. I know that it is complex question with many unknowns. When the PCB will be standard 1,5 mm 35/35 Cu and the amount of components will have any influence o
Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef
Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri
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