Electronics Forum | Thu Dec 23 22:41:42 EST 1999 | Dave F
http://www.portable-design.com/editorial/1997/02/297view.html http://www.rfdesign.com/ http://www.smtplus.com/prfh.htm http://ibme2.ibme.utoronto.ca/~anthony/subpages/hotsite.htm http://www.smtplus.com/rfwireless.htm
Electronics Forum | Wed Apr 15 12:55:31 EDT 1998 | Matthias Mansfeld
O.K., somebody read a probably hand-written 3 as 8. Under these numbers, I can find at IBM's Patent Server the following other topics: USP 4,312,692 http://www.patents.ibm.com/details?patent_number=4312692: USP 4,314,870 http://www.patents.ibm.com
Electronics Forum | Wed Apr 15 06:50:40 EDT 1998 | Matthias Mansfeld
Under these numbers, I can find at IBM's Patent Server only other topics: USP 4,812,692 http://www.patents.ibm.com/details?patent_number=4812692: "Motor" (Mitsubishi) USP 4,814,870 http://www.patents.ibm.com/details?patent_number=4814870: "Porta
Electronics Forum | Fri Mar 16 17:09:30 EDT 2007 | davef
Actel, IBM, AMD, Xilinx, Aeroflex, maybe more ...
Electronics Forum | Mon Mar 20 10:54:36 EST 2000 | Glenn Robertson
Jack - The last time I checked IBM was specifying a minimum of 4800 cubic mils of paste for each pad. This is required for acceptable reliability, not just to make the connection. There is no way you are getting that volume with a 5 mil stencil
Electronics Forum | Thu Jun 15 14:14:18 EDT 2017 | pfuhrman
I have seen a few references in this forum to an old study (1980s?) by Roger Wild at IBM. But I cannot find a published report or usable reference to one. davef mentioned the SMTnet archives as a possible source, but that has also been a dead end.
Electronics Forum | Sat May 30 18:09:17 EDT 1998 | Earl Moon
| Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | As everyone knows, IBM had problems with their ceramic BGA
Electronics Forum | Mon Jun 01 20:37:54 EDT 1998 | D.Lange
| | Got handed an assignment for which I'm not totally qualified. Don't expect this forum to had me all the answers. Some answers are obvious as the device types are fairly self explanatory. | | As everyone knows, IBM had problems with their ceramic
Electronics Forum | Mon Feb 14 21:01:15 EST 2000 | Thomas Ravener
IBM, Endicott, New York did extensive research on that. There was also some information I think that was published. You may want to contact Howard Manko of Manko & Associates. He's the soldering guru and has written many books on soldering & solderab
Electronics Forum | Thu Jun 29 14:29:25 EDT 2000 | Glenn Robertson
Leon - Remember for a CBGA you will need to use high-temp solder balls. IBM can supply the recommended solder paste (eutectic) volume. Glenn Robertson
