Electronics Forum | Tue Mar 10 20:43:22 EDT 2020 | victorzubashev
Hi all, I am evaluating the value of the purchase of a universal automated programming machine for SMD IC components(no operator to load/unload the component ). input: SMD reel, JEDEC tray, tubes output: JEDEC tray Required throughput: between 10,000
Electronics Forum | Wed Mar 04 17:19:29 EST 2015 | edwardt
Looking for any reliability data on aqueous flux residue causing low Z defects, specifically any data that may illustrate life expectancy under any humidity/temp environment. How long it takes for conductive material to migrate and form low Z impedan
Electronics Forum | Mon May 08 09:52:09 EDT 2006 | charles Stringer
We currently use Siplace P & P machines and in the main prefer to pick SOIC ICs from stick vibratory feeders. Our reason for this is that we can fit 3 stick fed devices into the same space as one reel fed SOIC. This reduces the amount of setup we hav
Electronics Forum | Sat Mar 06 17:45:29 EST 2010 | isd_jwendell
Unfortunately, what you are calling a good fillet is not a good fillet. Solder on the top of the IC lead does not help to make a good connection. The most important fillet is the one located at the heel (think of the IC lead where it meets the PCB as
Electronics Forum | Tue Mar 05 11:07:17 EST 2019 | sumote
Looking to purchase a DIP lead forming tool. The tool that has the 2 rollers that let you place the DIP part on the rail and run it between 2 rollers (ball-bearing?). I found a place that once sold them. They were called an RS Pro IC Insertion Tool
Electronics Forum | Wed Aug 28 10:51:27 EDT 2002 | edmentzer
We use a manual "pick and place" unit similar to the OK product, and it work great. The parts are in a tray and the operator moves the pick up head over the part and press down which turns on the vacuum, the vacuum is turned off when the part is pla
Electronics Forum | Mon Nov 07 07:55:36 EST 2011 | proteus
I have a leaded legacy board that I continue to make. I had a replacement for that board that was RoHS compliant. The compliant board was obsoleted. The legacy board has two parts that keep it form being made in a compliant manner. I found a coup
Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI
Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject
Electronics Forum | Wed May 27 14:35:52 EDT 1998 | Justin Medernach
| | R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recomm
Electronics Forum | Thu Sep 26 14:45:36 EDT 2019 | dwl
Excellent X-ray picture, very helpful! It looks like you have a lot of voiding on the center thermal pad. My guess is that outgassing is pushing solder off the pad which is forming solder balls outside the body of the component package. The first
