Electronics Forum | Sat Oct 12 05:40:05 EDT 2002 | Kenture
Hello All, I am having issued with insufficient solder due to via in pad. It is a 10 mils via and PCB is 70 mil thick. Six mils stencils was used since there are some 20 mils (No clean process). Any recommendation? Thank you.
Electronics Forum | Tue Sep 25 12:49:58 EDT 2001 | Hussman
Been there - done that. Makes a mess on that 2nd reflow process- doesn't it!?!?!? This is caused by design. If the open via is located in the land area, it will flow thru the via and cause pumps on the opposite side. You can have your vias filled
Electronics Forum | Fri Nov 23 15:46:06 EST 2007 | mika
Question: We have an issue right know on a prototype batch with via in the pad on an very small pcb 50x50mm (in a panel of course). The designer has no room to move the vias as they said. The pcb is to packed with components also 8-layers. It is also
Electronics Forum | Tue Aug 03 14:46:25 EDT 2004 | russ
We recommend to the designers "the smallest diameter that you can get away with", that will help reduce the solder scavenging into via diring reflow. unless you are planning on having them filled as Dave F mentioned. Russ
Electronics Forum | C.W |
Sat Jul 31 17:29:18 EDT 2004
Electronics Forum | Tue Aug 03 08:38:42 EDT 2004 | davef
Conductive epoxy is usually specified as less than 6:1 aspect ratio fill capable, while non-conductives are 10 to 14:1 (depends on which brand and who you ask).
Electronics Forum | Thu Sep 16 10:11:58 EDT 2004 | cburress
davef, Thanks for the reply. I've talked with IPC and they are currently reviewing this and attempting to compose some criteria. They "informally" recommend no greater than .002" also.
Electronics Forum | Mon Feb 26 20:02:42 EST 2001 | davef
First, I don�t understand why your board fabricator can�t do a good job plugging your vias. Additionally, when you consider that they forgot to plug the first batch of boards, it makes me wonder if they are desirable as a supplier. Generally, we us
Electronics Forum | Wed Oct 06 04:23:09 EDT 1999 | Brian
| | I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via
Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup
| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | John, | It depends......mainly on the via size. Tenting works on smaller vi
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