Electronics Forum | Thu Mar 26 11:25:21 EST 1998 | Earl Moon
In December and January (1997 & 1998) a number of people requested information regarding component cracking. I overlooked this until recently thinking design and process requirements were violated. After reviewing the last 14 months consulting effort
Electronics Forum | Tue Nov 18 18:25:57 EST 2003 | Gabriele
To process Multy Layer Ceramic Chip Capacitor is a critical process some time underevaluated mainly at rework or repair step. You can find useful guidelines on J-STD-001 G
Electronics Forum | Tue Nov 18 07:37:35 EST 2003 | Chris Lampron
Good Morning Everyone, Recently we have received a directive from one of our customers regarding processing of ceramic chip caps. The directive states that soldering irons shall not be used to process or rework any ceramic chip cap anywhere in the p
Electronics Forum | Wed Sep 26 11:58:13 EDT 2001 | Fox
Don't hold me to it but... Class 1-process indicator, varify value (cap, resistor) Class2,3-failure (rework required) This is what we used at my former job when i took over QA responsibility.
Electronics Forum | Fri Nov 21 14:11:09 EST 2003 | russ
We have a customer with the same requirements. We use a hot air pen to rework the caps. This is supposed to eliminate the thermal shock that is present when a soldering iron is used. The solder iron tip temp is usually 600-700 degrees and comes int
Electronics Forum | Tue May 26 16:59:47 EDT 1998 | Gary Simbulan
I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. Upon
Electronics Forum | Wed May 27 15:00:32 EDT 1998 | Scott Cook
| The question raised by our components engineering group is, is it possible to tell whether these failures are thermally or mechanically induced. The focus of design engineering up until now has been on process. Are our reflow temps ok, are the pa
Electronics Forum | Tue May 26 17:29:42 EDT 1998 | Earl Moon
| I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. | We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. U
Electronics Forum | Mon Jun 18 01:09:03 EDT 2001 | Dean Stadem
Igmar, If these parts are epoxied in place, and subsequently wave soldered, I would bet you a cup of coffee that they are cracking due to the thermal shock of the wave. Typically there is a valley or dip in the temperature after the pre-heat in the w
Electronics Forum | Thu Sep 23 20:23:58 EDT 1999 | Dave F
Jackie's posting recently and responses to it got me to dondering. First, recollecting, we bought an IR rework station a couple million years ago. It had a IR source on a stand, a bunch of lenses, and Reynolds aluminum foil for shielding near-by co
.gif)