Electronics Forum | Mon Jun 18 18:14:59 EDT 2001 | davef
Would comment extensively on the following? The time is a fact for X-ray inspection. If you set the contrast, tilting angle correctly (provide you did enough cross section to know the few type of failure mode: e.g. smaller balls, shorts, missing on
Electronics Forum | Tue Jun 19 12:15:45 EDT 2001 | Gil Zweig
I have made reference to X-ray Ball Bond Signatures a number of times, and I cannot overstate the importance of quickly qualifying the overall ball bond pattern as either uniform in size and shape or not. Software is available that will make this qua
Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
Electronics Forum | Tue Jun 19 10:59:21 EDT 2001 | Gil Zweig
When x-ray inspecting BGA packages with metal heat spreaders tube voltages greater than those used for Plastic BGAs must be used. It must be recognized, however, that the tube votage required will depend on the particular sensitivity of the x-ray cam
Electronics Forum | Fri Jun 22 13:13:54 EDT 2001 | dougt
I worked as a tech for a company that produced momagraphy equipment about 5 years ago. Every so often we had a problem with a board that was suspected to be the board material itself and used the mamography equipment to check this. In some cases it
Electronics Forum | Mon Jun 18 18:37:53 EDT 2001 | davef
OK. We have a new board with a BGA on it. When have a nice new Glenbrook xray inspection machine. Our troops are trained. Specifically, what are the steps we should use to qualify our BGA soldering process and how should be best use our new Glenb
Electronics Forum | Mon Jun 18 19:32:58 EDT 2001 | Gil Zweig
I believe that at the present time the industry really does not know how to use x-ray inspection apart from indentifying the obvious defects such as shorts, missing balls and gross solder voids. The real utility of x-ray inspection is to recognize: 1
Electronics Forum | Fri Jun 22 10:54:40 EDT 2001 | davep
The part is a high pin count PBGA with an integrated ceramic heatsink. What I am trying to understand is how to handle this part in production. It seems as though you would have to have an oven very near your SMT line, pulling a few trays of parts
Electronics Forum | Thu Jun 21 11:58:15 EDT 2001 | caldon
The data for this is overwhelming. My best advice would be to contact our lead-free specialists Lee Whitemann or Blaine Partee. Blaine's email is bpartee@aciusa.org Phone 610-362-1200 x 209. Lee's email is lwhitemann@aciusa.org Phone 610-362-1200 x
Electronics Forum | Thu Jun 21 02:43:24 EDT 2001 | Armin
is it easy to program ? e) User friendliness. Is the equipment easy to operate ? f) Tact Time. g) 2nd Hand Market Cost of the equipment. Rough guesstimate will do. I got feedback that noone service this machine anymore. Is it true? and that parts a
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