Electronics Forum | Wed Apr 22 23:25:15 EDT 2009 | jandon
We were using AIM WS485 SAC305 and AIM NC257 SAC305 and we had problems with voiding and AIM�s narrow process windows. Now we are using Indium3.2 and Indium8.9 with much better results.
Electronics Forum | Tue Jun 08 08:40:37 EDT 1999 | Wister
Hi,my master How to iron out such soldering bridge with below conditions: 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB 3.using spraying fluxer and no-clean fl
Electronics Forum | Tue Jun 08 08:38:15 EDT 1999 | Wister
Hi,my master How to iron out such soldering bridge with below conditions: 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB 3.using spraying fluxer and no-clean fl
Electronics Forum | Thu Jan 17 17:54:22 EST 2008 | dman97
Stay far away from the WS619 paste. It is a nightmare to get a decent solder joint out of it. And dont get me started on voiding issues with this paste. We eventually started to use Indium 3.2 lead free "water wash" paste and this drastically reduced
Electronics Forum | Thu Jan 10 02:16:09 EST 2019 | ameenullakhan
Hi Steve, Thanks. This from the trusted supplier. HASL finished PCB. Even PCB supplier is using the water wash flux for fabrication. Its almost eliminated with N2 environment. And we had got a expert view from Dr. Lee of Indium on the issue st
Electronics Forum | Fri Jun 28 03:04:21 EDT 2002 | Dreamsniper
Forgot to include the following: Dwell time is from 55 secs to 68 secs. Indium specs for the paste is maximum peak @ 228'C and 30 to 90 secs dwell time above 183'C. PCB is a 6 layer board with Dimension of 205 x 166 mm but is slightly dense with 11
Electronics Forum | Thu Aug 24 09:41:46 EDT 2000 | Dr. Ning-Cheng Lee
The optimal profile to choose is determined by the following factors, (1) thermal mass and distribution across the board, (2) reflow temperature range needed for a particular alloy, (3) the nature of flux. When the thermal mass is small, such as cell
Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F
| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n
Electronics Forum | Tue Jun 08 13:06:53 EDT 1999 | Kevin Hussey
| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl
Electronics Forum | Tue Jun 08 14:16:49 EDT 1999 | Dave F
| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl
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