Electronics Forum | Thu Mar 02 13:19:10 EST 2006 | Wave Master Larry
WELL, I heer that thikness was always wrong where I work, and for what ever reason the engineering department chose 6 milimeters. Personaly i would of gone 8 myself. I look under the magfying glass and always noticed in-suficient solder on the gull
Electronics Forum | Sat Jun 03 00:14:04 EDT 2000 | Ramon I Garcia C
Hi I don't speak english very well but some time I had A similar problem but the diference that we only procesed a single side, my pcb have one via hole barrel close to the pad then the solder flow throu the hole, my problem was an insuficient solder
Electronics Forum | Tue Jul 27 11:34:05 EDT 2004 | C Lampron
Nippy, This is exactly what we are seeing. The exessive pads are all on one side of the board. This is a 10 up panel 5x2. All of the QFP's on one side on the panel are not releasing or are not gasketing and causing bridging. So the defects are rangi
Electronics Forum | Sat Aug 26 12:26:57 EDT 2000 | Ramon I Garcia C
Hi friends: I have a problem in the process of one PCB, I have a lot of insuficients of solder in top of the board, this pcb already was working good, but sudenly began there isn't flow thru hole, I ran the profile and it was ok, if I inmerse i
Electronics Forum | Thu Apr 05 08:59:43 EDT 2007 | rgduval
Dave, I've seen some instances of solder as you mentioned "painted" over the joint. Almost looks like a seam between the added solder and the originally waved on solder. Typically, I've seen that in the past from an incomplete solder joint. One w
Electronics Forum | Mon Aug 16 04:38:18 EDT 1999 | Earl Moon
| Hello | I am looking for help in determining a simple (software based) method for testing the continuity of individual pins on an SRAM devices packaged in BGA. Can you help, or do you know someone who can help? Or do you know of an internet resouce
Electronics Forum | Tue Nov 13 09:36:18 EST 2007 | rgduval
From a manufacturing standpoint, this isn't very nice. Vias will tend to wick solder away from the pad, resulting in insuficient solder joints, which require touch-up. The amount of times any solder joint is reheated should be minimized, as extra h
Electronics Forum | Tue Jan 21 13:51:19 EST 2014 | rgduval
Armando, Is the problem in the same spot on the board with every run? If so, there might be something about that particular location that is part of the cause (ie. ground or power plane connection). It sounds like you're seeing blow holes, or insu
Electronics Forum | Wed Apr 12 22:26:08 EDT 2000 | Alberto Hern�ndez
Hi Kevin!!! I have worked with both sides boards in 3 differents ways: a)Glue-Solder paste- Manual assembly- Wave soldering For the bottom side we placed glue dot in the board then we placed parts and finally the convection reflow at 150�C each zone
Electronics Forum | Tue Mar 16 18:27:34 EST 1999 | Earl Moon
| We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of it
