Electronics Forum | Mon Aug 27 08:16:23 EDT 2012 | rway
No, in his case an ICT in not out of the question. An ICT, especially with many passive components, can give you piece of mind that the assembly was built correctly. Even with the addition of an automated insertion machine, you still run the risk o
Electronics Forum | Wed Apr 17 08:35:17 EDT 2013 | emeto
I currently run Siemens and they have their own recommendations about placement force. Most of the passive parts will be placed using 2N. For some BGA'a we will go about 4N and for certain parts that are very easy to break you should go 1N. All parts
Electronics Forum | Fri Dec 19 12:43:01 EST 2014 | emeto
I had some of these before and they do a decent job. Laser alignment is ok for passive components. Compared to vision systems it has mainly disadvantages. If you have bended lead on IC for example, it wouldn;t catch it and it will place the part. I w
Electronics Forum | Mon May 02 12:24:11 EDT 2016 | adamjs
One word: Dispense your paste That's three words! Unfortunately the board has nine LGA components. Stenciling is the only way to get the required consistency in deposit shape and volume. If the board were all passives+QFN I would definitely use a
Electronics Forum | Thu Feb 01 05:06:46 EST 2018 | ameenullakhan
Hi Rob, Thanks for your reply. Our customer don't need any pin hole in his board. Attached is the image for your reference. The issue is minimized for us with hot profile ( 80 - 100 sec in between 170 to 180 deg C ) For leaded paste. Lead free pa
Electronics Forum | Fri Feb 09 13:28:24 EST 2018 | jmedernach
Pin holes in the solder joints on various devices can be an indicator of something amiss with the solder paste itself. Solder paste storage may be a concern. Do you possibly have someone putting paste back in the refrigerator after use? Are you tr
Electronics Forum | Tue Feb 13 14:39:52 EST 2018 | horchak
Your profile reflow temps are too low. Omnix338 has a melting temp of 217-221C. Your right on the edge, and your soak temps should be closer to 150 than 180C. Bottom line too high a soak, too low a reflow. Take it or leave it.1874
Electronics Forum | Tue Feb 13 14:52:32 EST 2018 | emeto
I am totally with SweetOldBob on this one. Contamination or voids can also help to boost this defect, but considering that you are probably entirely burning off your flux in the soak zone, you might be getting oxidation on your pads and actually get
Electronics Forum | Thu Feb 15 02:27:51 EST 2018 | ameenullakhan
Thanks for the wishes BOB. I am into process engineering. We don't contact the customer. SMT Line support. Customer might approve also. But our own quality team says its profile issues :(. Will see.what more can be done from our side. Thanks, Ame
Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra
What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of
