Electronics Forum | Thu Nov 10 08:23:35 EST 2005 | arclightzero
Hello, I am currently trying to isolate internal fallout problems with very low yield substrates mixed with great yields and have recently found that we are using a Sn62/Pb36/Ag2 solder paste with full tin (no lead) components as well as Pb95/Sn5 sol
Electronics Forum | Mon Nov 14 10:10:52 EST 2005 | davef
When soldering your full tin (no lead) and Pb95/Sn5 solder components, you need to modify your PbSn reflow recipe to compensate for the higher melting point of the changed solder alloy [with your Sn62/Pb36/Ag2 solder paste] on those component leads.
Electronics Forum | Thu Oct 21 17:05:11 EDT 2004 | davef
While it's not exactly what you asked, it's similar. Here is a thread from the fine SMTnet Archives from a couple of weeks ago, where we spoke about the topic of mixed lead-free solder with components that have lead-bearing solderability protection:
Electronics Forum | Wed Oct 04 16:54:24 EDT 2006 | cw
OK. Thanks!! Lastly, is it the nature of the chemistry that Sn/Pb solder mixed with Pb-free alloy will be getting voids? If so, what's the physic/chemistry behind it?
Electronics Forum | Fri Feb 23 09:12:13 EST 2024 | carl_p
How have you created the oven profile? Have you taken into account the heat soak from the components/board/carrier etc. Is the paste being mixed correctly before use, is the paste in its use by date & at ambient temp etc? I thought almost all the
Electronics Forum | Fri Feb 23 14:50:14 EST 2024 | carl_p
That link doesn't work for me. From the more you explain - it does sound like an issue I've had in the past on a few different builds. In the end we traced it to a fault with the paste (they were having mixing issues in the chemistry) but they as y
Electronics Forum | Fri Oct 06 08:21:26 EDT 2006 | inds
Mario, what happens when there are components on the boards that are not rated to take temperature of 230-240 C Peak for a mixed assembly. I guess there are tons of sn/Pb components that have rated temp of 225-230 C.. So in guess you might want
Electronics Forum | Fri Feb 23 09:35:36 EST 2024 | emanuel
We have the standard profile as a template made according to the solder paste specs. For some boards we measure the result at 2 points, on the board itself and on top of a sensitive SOT263 module and adjust accordingly. The solder paste is well kept,
Electronics Forum | Tue Apr 29 13:43:34 EDT 2008 | arminski
THANKS FOR YOUR REPLY GUYS... more background... solder paste is Water Soluble. We mask the potentiometers prior to aqeous washing using solder mask, then our operator brush the solder joints with IPA after the Wash Process...I'm concerned about th
Electronics Forum | Tue Aug 01 22:04:11 EDT 2006 | davef
Problems with IPA are: * IPA / material being 'cleaned' combination still needs to be removed from the board. * IPA and empty containers are a hazardous material by RCRA criteria (40CFR 261) * Flash point (~12*C TCC) of IPA is low enough that all ele
winsouce.jpg)
.gif)
