Electronics Forum | Wed Mar 23 10:16:47 EDT 2011 | blnorman
If these are moisture sensitive they are required to be shipped in a moisture barrier bag and labeled as moisture sensitive. Depending on which moisture sensitivity level (MSL) the components have, floor life can range from unlimited to a mandatory
Electronics Forum | Mon Sep 09 15:38:20 EDT 2013 | action_101
For the proper baking durations for msd componrnts you should follow the ipc/jedec j-std-033b standard. Just google that standard and the pdf should come up. On page 16 there is a complete table showing the temps and durations.
Electronics Forum | Mon Jul 04 09:08:41 EDT 2016 | davef
IPC/JEDEC J-STD-033B.1 Includes Amendment 1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices [http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf]
Electronics Forum | Fri May 05 11:10:07 EDT 2000 | John Thorup
Hello Aerin...welcome Actually you have already found a very important web site for your research. Go to the SMTnet archives and do a search. You will find a wealth of practical information. After that, go to the IPC or the JEDEC website and downlo
Electronics Forum | Wed May 04 04:31:44 EDT 2005 | siverts
What is the MS-level and floor life of the critical components (should be written on the MSD-bag)? What is Your climate condition in the production area (%RH, temp.)? Are you doing this inspection on every board or is it enough to do it on the first
Electronics Forum | Tue Jul 17 00:10:32 EDT 2012 | amitsindwani
Referring to IPC/JEDEC J-STD-033B.1 section 3.3.2.2 'The amount of desiccant used, per moisture barrier bag, shall be based on the bag surface area and WVTR in order to limit the interior relative humidity in the MBB to less than 10% at 25°C.' So wha
Electronics Forum | Sun Mar 25 22:21:03 EDT 2007 | sleech
Let me explain. At 125 degrees C, the oven is above the boiling point of water. It will be vaporized and eventually be vented from the oven. However at temperatures of 90 degrees c and lower the relative humidity becomes an issue. For the life of me,
Electronics Forum | Wed Jun 20 21:58:37 EDT 2001 | fmonette
Dave, if you have a level 6 then you have no other option then to bake it and reflow before it exceeds the specified floor life. For more details check out the joint IPC/JEDEC standard J-STD-033. It can be downloaded for free at http://www.jedec.org.
Electronics Forum | Tue Sep 19 11:28:09 EDT 2000 | Wolfgang Busko
Mikeal�s approach is one of the more cautious ones. IPC/JEDEC J-STD-033 clause 8.6 talks about 200�C body-temperature not to be exceeded and how it�s best measured. If you go for that method and you made sure that in your wavesoldering (that�s what
Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg
In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br
