Electronics Forum | Tue Dec 21 17:58:44 EST 1999 | Brian W.
When doing PIH processes, it is critical that you control the solder VOLUME, not the height. You must define the process, monitor it and control chart it to keep the paste volume consistent. You have do some careful engineering to determine how muc
Electronics Forum | Sun Sep 21 10:03:15 EDT 2014 | gascon5383
hi, there is an IPC standard, IPC-A-610 - Acceptability of Electronic Assemblies. According to this manual, solder in the bends of a lead does not matter, but solder touching the body of a component is a defect. I cannot find a specific reference in
Electronics Forum | Mon Jun 08 15:01:02 EDT 1998 | D.Lange
| I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot
Electronics Forum | Wed Feb 29 06:33:49 EST 2012 | amitsindwani
Please define the defect in following conditions & link to IPC 610 clause/sub-clause no.: 1. 0603 component placed on 0805 PCB pad 2. 0805 component placed on 0603 PCB pad 3. 1206 component placed on 1210 PCB pad and 4. 1210 component placed on 1206
Electronics Forum | Tue Jul 25 13:40:04 EDT 2017 | davegoad
I have some CERSOT-23 transistor packages with castellated terminals. The 4th lead (drain castellation) is electrically connected to the top of the device by the castellation. The castellation goes up the ceramic body and contacts the metal package
Electronics Forum | Wed Jun 02 15:27:27 EDT 1999 | JohnW
| | Hi, | | | | To improve the Design For Manufacturing I am currently looking to write down some design rules that can (and should be) used by our engineering department. | | | | Can somebody help me get started or give some usefull tips on where
Electronics Forum | Wed Aug 21 09:09:50 EDT 2013 | wcheew
I am having solder barrel fill issues on THM component, we follow, we follow IPC 610 E requirement. The barrel fill issues happen on signal & ground pin at connector & E-cap. I found out that most of the insufficient solder happen on the connector ag
Electronics Forum | Mon Jun 11 22:00:19 EDT 2001 | davef
IPC-A-610 uses words to the effect that it�s a Class 2 process indicator, if either: * Entrapped or encapsulated solder balls that are within 0.13 mm [0.00512 in] of lands or connectors, OR * Entrapped or encapsulated solder balls exceed 0.13mm [0.00
Electronics Forum | Thu Apr 05 09:18:14 EDT 2007 | pjc
Please note that pin holes and blow holes are not always defects. The latest IPC 610A Rev D workmanship standard has them as process indicators- depending on Class. I don't have the document handly while writing this. It would be good to look that up
Electronics Forum | Tue Jan 25 21:59:44 EST 2000 | Dave F
Michael: On reliabiliity, consider that: � IPC-SM-782, "Surface Mount Design And Land Pattern Standard" and IPC-D-279, "Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies" specifically describe via in pads as "poor des
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