Electronics Forum: ipc 9701 (Page 1 of 1)

Is IPC-9701 apply to QFN package?

Electronics Forum | Sun May 24 21:12:59 EDT 2009 | keith78

I have a problem recently to qualify QFN package on solder joint reliability. The pcb thickness stated in IPC-9701 is 2.35mm but from the in-house test, QFN surface mount on 2.35mm thickness PCB board have a short cycle to failure due to higher CTE m

Thermal screening for marginal BGA joints

Electronics Forum | Sat Nov 03 09:29:17 EDT 2007 | davef

IPC-9701, SMT Solder Joint Reliability Qualification and Performance Standard is an update of D-279, Design Guidelines For Reliable SMT PCA that includes BGA and PbFree

Cu% spec for lead free HASL surface finish

Electronics Forum | Wed Nov 28 22:33:24 EST 2007 | davef

There is no specification for lead-free HASL. You can use any lead-free solderability protection that meets your customer requirements. Use IPC-9701 �Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments� to ass

International certification programme for lead-free product test

Electronics Forum | Tue Feb 03 09:36:05 EST 2004 | davef

Unfortunately, IPC-D-279, IPC-TM-650, IPC-TR-464, and MIL-STD-810 will not answer your questions, because they do NOT address LF-solders. Even the tests in IPC-9701 need to be modified for LF-solders, because: * LF-solder has different creep behavior

Solderability Life Estimation

Electronics Forum | Tue Jul 03 10:20:15 EDT 2018 | yannis

Our firm is SMT factory exclude design, components are selected by customers. We are going on a project by studying the solderability life of warranty at least 3 year for customers requirement. The theory is if the workmanship is good enough, then th

Reflow profile negative temp ramp rates

Electronics Forum | Tue Apr 09 08:49:43 EDT 2002 | davef

Hey Bud. Allow me to 'turn' your point about 'grain structure' just a bit. Fast cooling rates / coarse grain structures was a bit of red herring in the early 80's. Faster cooling DOES produce finer grained solder connections. Accelerated testing of

Re: Reliability of coated Plastic encapsulated Microcircuits

Electronics Forum | Wed Jul 22 00:43:05 EDT 1998 | P.L. Sorenson - Technical Consultant

| Who knows something about the reliability of plasti PEMS and its enhancemant by application of conformal coating (Parylene, metal, SiO2, SiNxOx, etc.) ? My personal experience using PEM for military avionics applications has been very positive. H

Re: Reliability of coated Plastic encapsulated Microcircuits

Electronics Forum | Wed Jul 22 15:48:35 EDT 1998 | David Pinsky

| | Who knows something about the reliability of plasti PEMS and its enhancemant by application of conformal coating (Parylene, metal, SiO2, SiNxOx, etc.) ? | My personal experience using PEM for military avionics | applications has been very positi

Accelerated testing to Service life conversion

Electronics Forum | Tue Aug 07 20:43:47 EDT 2001 | davef

First, we know that MIL types are wont to use charts like that. Give �em Weibull distribution tables and then they�ll be happy, happy. A good book is Nelson �Accelerated Testing: Statistical Models �� Wiley Second, we don�t use that very nice stu

SMT COMPONENTS TESTING

Electronics Forum | Mon Jan 09 15:49:50 EST 2006 | GS

You can find some good idea by reading IPC-J-STD-002B (or later review ) Solderability test and also the JEDEC Standard (free down load) JESD22-B102D solderability test. A suggestion, first of all check how old are the chips (read data Code on Label

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