277 ipc and 2221 results

Electronics Forum: ipc and 2221 (Page 15 of 28)

optimun height between lead and pad?

Electronics Forum | Tue Dec 04 09:48:43 EST 2001 | davef

Defining the thickness of solder between the lead and the pad, J-001 states "Properly wetted fillet shall be evident." J-001 is available from http://www.ipc.org. Factors that affect this are: * Amount and composition of solder * Amount and compo

PTH Hand Soldering and Rework Training

Electronics Forum | Mon Jan 13 12:33:27 EST 2003 | Steve Freeman

We are currently looking for a local source to perform in house, hands on training for PTH hand soldering and rework. The instruction must be hands on and cover from the basics of soldering through performing rework. We have investigated training thr

IPC Class II and Class III reliability

Electronics Forum | Wed Apr 09 14:09:54 EDT 2003 | davef

MA/NY DDave, I'll take your money. I'm betting on the Class II, whatever that is, because: * Solder is the same. * Board is the same from a fabrication and probably materials standpoint. * Components are the same. * Processing is the same. ... but

IPC Standard for Acceptable and Reject Criteria

Electronics Forum | Thu Nov 04 15:06:33 EST 2004 | dramos1

Hi Russ, Thanks for the input. We already check our subcontractor mounting of the connector on the board and it seems that the problem is related to some batch of connectors from their vendor. Anyway, i believe that your suggestions on the agreement

Lead Free and Leaded Process Mix

Electronics Forum | Tue Jul 19 06:07:30 EDT 2005 | GS

Yes Rob, I would like to know the type of metal finisching like JST097 or IPC-1066 or IEC .... suggest to do. I would like to avoid i.e. to get Bismuth finish on components terminals that I still have to solder with alloy containing Pb. Also to ha

SMT Design: Package distance and stand-off height

Electronics Forum | Thu Nov 13 22:20:48 EST 2008 | davef

For your pad layout and spacing between components, look here: http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=77b562c1-b8f8-db11-8a6a-005056875b22 For your standoff height in SMT, we do not concern ourselves with standoff height. It

Mixing No-clean and water soluble processes

Electronics Forum | Wed Feb 24 10:23:04 EST 2010 | xps

60° C). Moreover (by IPC standard)... "White residues resulting from no-clean or other processes are acceptable provided the residues from chemistries used have been qualified and documented as benign...". So, use an EDX or IC analysis in order to

PCB Thickness and Score Depth Standards?

Electronics Forum | Fri May 24 17:35:59 EDT 2024 | dontfeedphils

A couple questions for everyone: 1) is there an industry spec that calls out v-score depth requirements? If so, what spec is that and what are the values? I've always heard 1/3 of the depth of the PCB on each side, but I'm not sure if that's a rul

PCB Thickness and Score Depth Standards?

Electronics Forum | Tue May 28 18:57:40 EDT 2024 | lambert

The scoring or grooving creation is found in IPC-2222 and describes the standard scoring parameters, with an illustration of the critical parameters. There are many articles on the web describing the process. Many of the articles promote a groove dep

warped boards and cracked solder joints

Electronics Forum | Mon Oct 29 18:21:43 EST 2001 | slthomas

We recently have received a lot of warped (bowed and/or twisted behond IPC 600 specs.) bare boards (some our fabricator's fault, some ours by design) and I can't help but figure that long term reliability will suffer when building product with them.