Electronics Forum | Wed Mar 02 16:48:03 EST 2005 | davef
Try: * SMT-In-Focus SMT Failure Library http://www.smtinfocus.com/smt_failure_list.html * Bob Willis Defect Browser http://www.smtinfo.net/Db/_Bob%20Willis%20Defect%20Browser.html
Electronics Forum | Wed May 08 20:14:24 EDT 2013 | davef
What happens when you rework those non-coated areas? Please list your rework steps Br, davef
Electronics Forum | Thu May 09 13:49:24 EDT 2013 | davef
First, it appears that your solder mask and your coating material appear to be incompatible. Second, IPA leaves a residue that's probably not compatible with your coating material, either. IPC-HDBK-830 - Guidelines for Design, Selection and Applic
Electronics Forum | Wed Mar 10 16:48:13 EST 2021 | rsatmech
Below list based on my observations. Nozzle block Sensor block Insufficient issue in printing Solderability issue due to fod
Electronics Forum | Thu Jun 13 14:41:40 EDT 2024 | tommy_magyar
Hi David, In one of my previous jobs I worked as an AOI/AXI process engineer and we had a set target of 75% FPY. This means that 75% of the boards at IPC Class 3 standards would not have a single false call. This also means you would need to set y
Electronics Forum | Fri Oct 07 08:48:45 EDT 2016 | davef
Two things ... A friend in the contract coating business said: "... the board is not being baked out long enough, 30 min is certainly not long enough depending on how many layers this board is, as the vacuum (from the parylene process) is pulling t
Electronics Forum | Tue Nov 20 12:21:02 EST 2001 | mparker
First, determine a standard to follow. IPC/EIA J-STD-001C "Requirements for Soldered Electrical and Electronic Assemblies" is most current for electronic assemblies. Second, by your customers spec. determine which class of the standard to apply. Use
Electronics Forum | Wed Nov 03 09:59:47 EST 2004 | Simon UK
Hi Dennis, I would say that you must meet one of the acceptable critera if you have others list, but it depends. Do you have a specific query in relation to a solder joint or other defect?? Simon UK
Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef
Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated
Electronics Forum | Thu Sep 27 10:28:29 EDT 2001 | John S
It seems to depend on your situation. We're an OEM manufacturer and run the same products for extended periods of time. We monitor process indicators such as Dave listed, but we also monitor process defect trends. This is product specific of cours
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