Electronics Forum | Wed Jan 15 23:32:36 EST 2003 | tinson
How about section 12.2.12 of IPC-A-610C? It doesn't include detailed description of root cause/effect but acceptance criteria.
Electronics Forum | Thu Apr 23 07:51:45 EDT 2009 | scottp
Every paper I've seen published shows that BGA voids either have no effect or actually give a slight improvement. The one exception are voids with a root cause in bad incoming boards, such as champagne voiding where nearly the entire interface is go
Electronics Forum | Mon Mar 12 09:55:55 EDT 2007 | coop
I am aware of the IPC A-610 standards on acceptability of electronics, but this place builds our products to an even higher standard. the problem is on the two leading corners of the IC's as they go into the wave.
Electronics Forum | Mon Sep 19 07:56:19 EDT 2005 | Pop
How we can improved the Solder voids on QFN Packaging. Actually we adjust the time for solking to long . But is not affected. Pls advise. ThANK YOU
Electronics Forum | Sat Apr 15 14:28:26 EDT 2006 | Dan Mendoza
This may sound like advertasing, but I ran a DOE with five solder paste/flux manufacturers and somehow, the voids went away with the AIM solder.
Electronics Forum | Mon Sep 19 09:08:25 EDT 2005 | siverts
Search the SMTnet archives first. Ex. http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=8877&#Message35126
Electronics Forum | Tue May 07 10:36:38 EDT 2019 | slthomas
Probably just means you started out with an optimal profile. I suspect that not everyone does. ;) It seems like we did have some luck with profile adjustments in one instance with some QFN's with a large thermal pad. Like I said, though, the profi
Electronics Forum | Sat Jul 20 14:55:55 EDT 2019 | davef
IPC-A-610F 8.3.13 Bottom Termination Components (BTC) ... Thermal plane void criteria shall be established between the manufacturer and user IPC-A-610F, 8.3.14 Components with Bottom Thermal Plane Terminations ... Thermal Plane Void Criteria -
Electronics Forum | Fri Jul 19 13:02:01 EDT 2019 | davef
Double-check me on this, but I don't believe that A-610 [IPC-A-610] requires side fillets on QFN solder connections, because the sides of most terminations are not plated. Plating on the bottom of the termination is sufficient for a proper solder con
Electronics Forum | Wed Mar 27 04:32:49 EDT 2019 | pavel_murtishev
Charliem, Thank you for the input. Following this logic, in case if there are no soldering issues, pad coverage and voiding levels are within acceptable limits and a gap between BTC and pad let us say 200um, this could be accepted, right? IPC-A-61
