Electronics Forum | Wed Mar 10 08:33:36 EST 2004 | Gabriele
Take look also at IPC-HDBK-001, if not yet done, you can find helpful flux informations. Rgards GLS
Electronics Forum | Tue Aug 26 07:44:06 EDT 2008 | davef
Industry-wide, there is no current requirement for baking of bare boards. It adds no value. * IPC-HDBK-001 has guidelines olden times. * IPC-TM-650 has several test methods to determine moisture resistance to both liquid immersion and absorption from
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Fri Mar 19 13:42:05 EST 2004 | blu_nozer
J-STD-001 is the workmanship standard. IPC-A-610 is a guide to evaluating conformance to the standard & includes photographs of compliant and non-compliant examples. In addition there is also IPC-HDBK-001 which expands on the bare requirements laid d
Electronics Forum | Fri Jun 01 17:31:17 EDT 2007 | gsala
Thanks Patrick, also IPC-HDBK-001 explains even better then IPC-J-STD-004, but unfortunately not yet infos about flux for L-F soldering.That's why I am trying to get some infos more from experienced people. Some L-F (SAC or SACX) cored wires vendor
Electronics Forum | Wed Aug 06 20:50:42 EDT 2003 | davef
Well, if it "keeps coming up", let's take a pass at keeping down. For: * Requirement that gold be removed from components, pads, etc. is J-STD-001C, 5.4.1 * Context of that requirement [J-STD-001C, 5.4.1] and 6 or 7 references are in IPC-HDBK-001.
Electronics Forum | Tue Jun 29 14:42:55 EDT 2004 | davef
You're correct, for every dumpster full of paper written about solder, there's a sentance written about fluxes. There's dribs and drabs about fluxes in most of the soldering books [ie, Manko, Klein-Wassink, Judd, Strauss, etc] and most of that is ve
Electronics Forum | Thu Dec 26 12:12:55 EST 2013 | igorfo
Dear Friends, I need your help to understand requirements and measurement methods for bow and twist of assembled PCB (PCBA have and SMT and TH components). I already check all posts on the site but didn't found any related to my question answers.
Electronics Forum | Fri May 12 09:24:45 EDT 2000 | Ashok Dhawan
I need to install two SMD chips (0805) at one location. I refered to IPC-HDBK-001, fIG 6-24. When I solder the chips side by side, the ceramic side which is placed againgst solder pad- is already touching the solder. While I complete the solder joint
Electronics Forum | Tue Sep 09 20:32:10 EDT 2003 | davef
The maximum ratio of gold weight to solder alloy weight can be calculated, to help prevent a problem from excessive gold-tin intermetallic compound (i.e., AuSn4). For the equation and its derivation, please refer to "The Use of Capillary Action Measu
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