Electronics Forum | Thu Jun 23 22:30:31 EDT 2005 | wjxingggg
poor soldering of PCB. > unfit stencil hole of QFN > incoming problem for this component >...... What is your opinion? or what can I do for the next step? Thanks again.
Electronics Forum | Fri Jun 24 07:02:35 EDT 2005 | davef
Problem 1: Solder shortage * Stencil aperatures [except the heat slug] should be 1:1 with the board. * Stencil should be 5 thou thick laser cut. * Board should be 1:1 with the component * Print should look good. Problem #2: Bad connection between p
Electronics Forum | Sat May 04 12:43:48 EDT 2019 | davef
ISO/TS 16949 is a quality management system for automotive sector
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Thu Nov 20 03:58:39 EST 2014 | hhat
To get the best performance of electronic circuits, components and circuit board supports circuit components and devices in electronic products. Even if the circuit principle diagram design is correct, the printed circuit board is designed improperly
Electronics Forum | Tue Sep 11 19:54:52 EDT 2001 | gsparka
HELLO. SMTNETERS there is no company in high mix low volume system in our contry so . what is the best way to calculate the capa. of smt line in high mix low volume. & what is the general way to get the defect rate to evaluate the smt line(or sm
Electronics Forum | Fri Sep 24 10:57:18 EDT 1999 | Earl Moon
| Hi Folks: | | We've been having bridging problems on our fine-pitch QFP's, despite thorough inspection of paste height, volume, and placement accuracies....profiles look good also. | | The bridging is happening after coming out of reflow...one la
Electronics Forum | Thu Jan 02 11:35:30 EST 2003 | Richard
Cleanliness test � �Area Grid Arrays�. Evaluation of residues� resistivity in a specific location on the board. (As compared to �Solvent Extract� evaluation.) We are: SMT assembly, using standard �water soluble� process with micro BGAs (example: C
Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
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