Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben
I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i
Electronics Forum | Sat Mar 28 12:04:24 EDT 2009 | davef
Bound books with concise information on SMT implementation are: * A compilation of "Step By Step" articles from SMT Magazine: http://www.booknews.co.uk/Books/Book4490.html * Setting Up In-House Surface Mount Technology [Books], Schoch, K.F., Jr., El
Electronics Forum | Fri Oct 22 03:23:37 EDT 1999 | Brian
I agree with John, but Manko has also published 'Soldering Handbook for Printed Circuits and Surface Mounting' (van Nostrand Reinhold, a little more practical and less strong on the theory of his classic one, which is beginning to date (1st published
Electronics Forum | Mon Jun 14 11:44:10 EDT 1999 | Vince Gedgaudas
Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not causin
Electronics Forum | Sat Mar 28 03:26:59 EDT 2009 | gvkirubakaran
Dear sir, We are first time purchased in SMT machine and Through hole machines 1) Please suggest me, i will started the process in first the SMT process or the Axial machine and Radial machine process (THT Line) 2) i want SMT line process proced
Electronics Forum | Sat Apr 03 05:21:33 EST 2004 | mattkehoe
There is a method for VIP you may not be familiar with. I dont want to go into depth here but check out http://www.sipad.com/sipadvip.htm and contact me off line if you want more info. Good luck. mk
Electronics Forum | Sat Mar 27 08:15:02 EST 2004 | davef
Via in pad is a designer's dream and an assembler's nightmare. Search the fine SMTnet Archives for previous discussions to get started. VIP, via-in-pad, or whatever tend to promote voiding within the via and certainly partially starved solder conne
Electronics Forum | Tue Feb 27 20:42:56 EST 2007 | pyramus
Hi anybody have experience with the Package on Package BGA components. I mean BGA over a BGA component assembly. Our R&D is requesting us feedback for the future usage of this part. Need to gather some info on possible SMT issues for usage of this B
Electronics Forum | Wed Mar 14 16:23:01 EDT 2007 | J
I am not sure Ersascope and X-Ray will tell you the results you are looking for. My experience with x-ray has proven that misalignment, voids, and bridging are really the only failures that can confidently be observed. You may have solder in place,
Electronics Forum | Wed Feb 28 00:12:22 EST 2007 | Muhammad Haris
hi, Consider BGA1= bigger one BGA2= smaller one CONSIDERATION : 1. If bga2 is inside the bga1 then bga1 balls should not touch the bga2 upper surface i.e. the inside balls of bag1 package should b in ur mind, so choice is urs. METHOD: m
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