Electronics Forum | Fri Oct 26 17:20:15 EDT 2012 | joeherz
Hello, I need to find a wire tinning pot with temp control that will conform to J-STD-001 requirements. I'm looking at American Beauty and Plato models. The American Beauty models appear to be capable but the low prices make me wonder. Any advice
Electronics Forum | Thu May 23 18:10:54 EDT 2013 | davef
I agree with Rob. These solder connections are unacceptable. BR, davef
Electronics Forum | Thu May 23 18:40:48 EDT 2013 | rway
I also agree. Even if it did meet specs, I wouldn't let a joint like this out. Reese
Electronics Forum | Tue Sep 06 12:41:52 EDT 2016 | kmclain
IPC J-STD-001 does not allow solder inspection to be combined with coating inspection for classes 2 and 3.
Electronics Forum | Mon Feb 21 20:15:49 EST 2022 | arminski
since IPC-J-STD-001 RevH obsoleted the 1.56ug/cm2 UCL of ionic contamination tester in testing using ROSE test, how do you define the acceptable limit per PCB assembly? thanks
Electronics Forum | Mon Jan 15 21:54:19 EST 2007 | raychamp007
Dear Friend, Our SMT Production & component ware house RH currently control limit set to 40%RH - 60%RH, but not always achievable, the RH reading measurement are between 38%RH -65%RH. J-STD-001D recommend 30%RH - 70%RH. However it is only a recommen
Electronics Forum | Thu Jul 31 23:07:55 EDT 2008 | davef
J-STD-006 lists maximum contamination levels for most solder alloys. This is the basis for purchasing solder. The SOLDER BATH contamination levels in J-STD-001 are based on decades of experience. But these contamination thresholds of various metals
Electronics Forum | Fri Mar 19 13:42:05 EST 2004 | blu_nozer
J-STD-001 is the workmanship standard. IPC-A-610 is a guide to evaluating conformance to the standard & includes photographs of compliant and non-compliant examples. In addition there is also IPC-HDBK-001 which expands on the bare requirements laid d
Electronics Forum | Sat Aug 11 09:33:09 EDT 2007 | davef
Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no baking of assemblies, only boards [and for the anal, components]. J-STD-001DS, 4.9.3 Drying/Degassing. Prior to soldering, the assembly shall be treated to
Electronics Forum | Wed Jul 24 22:45:54 EDT 2002 | davef
WS609 is a wonderful paste. J-STD-001, 4.2 states words to the effect that for Class 3 products Type H or M fluxes should only be used for tinning operatins. Most water soluable fluxes are either H or M. I believe that you can use Type H or M flux
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