Electronics Forum | Tue Mar 21 20:27:26 EST 2000 | Dave F
Sorry, I went dyslectic of the doc numbers, but you get what I mean (I hope): * J-STD-001B was released October 1996 * J-STD-033A was released April 1999 Without belaboring the point further, J-STD-001C is current and contains references to J-STD-
Electronics Forum | Tue Mar 21 20:27:26 EST 2000 | Dave F
Sorry, I went dyslectic of the doc numbers, but you get what I mean (I hope): * J-STD-001B was released October 1996 * J-STD-033A was released April 1999 Without belaboring the point further, J-STD-001C is current and contains references to J-STD-
Electronics Forum | Sat Feb 18 17:02:30 EST 2006 | GS
72h " and " Exceeding Floor Life =
Electronics Forum | Fri Feb 17 16:46:29 EST 2006 | GS
Hi CW, mine is not the answer to your questions, but I suggest you to take a look of the latest level of J-STD-033B (October 2005) The J-STD-033A was from July-2002, and several important points are different from latest level. For instance, in Cha
Electronics Forum | Fri Feb 17 16:50:58 EST 2006 | GS
Hi CW, mine is not the answer to your questions, but I suggest you to take a look of the latest level of J-STD-033B (October 2005) The J-STD-033A was from July-2002, and several important points are different from latest level.For instance, J-
Electronics Forum | Wed Feb 15 19:27:24 EST 2006 | CW
Reviewing the J-STD-033A procedure and try to better understand Table 4-1 ... There are 3 columns for Baking Temperature & recommended Duration ... 1st one is for 125C, then for 90C, then followed by 40C ... it also specify the environmental condi
Electronics Forum | Thu Apr 01 12:44:06 EST 2004 | Chris Lampron
Laxman, JEDEC J-STD-033A has a bake time/temp table based on different package thicknes.
Electronics Forum | Wed Dec 15 18:09:10 EST 2004 | DasonC
Jedec J-STD-033A for components. For the Fab and assy, you can check IPC-PE-740, Para. 1.5.4
Electronics Forum | Tue Jan 18 15:06:55 EST 2005 | DasonC
Check J-STD-033A. You can get free copy from http://www.jedec.org. It will describe all the information including baking, storage, etc. Regarding the cycle for the baking need refer by supplier since baking will increase the oxidation rate on the b
Electronics Forum | Thu Mar 24 12:59:14 EST 2005 | DasonC
Desicattor is used for storage and not the indicator or meter to check the humidity. I am not sure that the HIC will affect the solderability, if yes, when they pack together with the MSD then we also have solderability problem on component. Per J-
