Electronics Forum | Mon Jul 04 09:08:41 EDT 2016 | davef
IPC/JEDEC J-STD-033B.1 Includes Amendment 1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices [http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf]
Electronics Forum | Thu Apr 01 12:44:06 EST 2004 | Chris Lampron
Laxman, JEDEC J-STD-033A has a bake time/temp table based on different package thicknes.
Electronics Forum | Wed Dec 15 18:09:10 EST 2004 | DasonC
Jedec J-STD-033A for components. For the Fab and assy, you can check IPC-PE-740, Para. 1.5.4
Electronics Forum | Wed Mar 23 10:16:47 EDT 2011 | blnorman
If these are moisture sensitive they are required to be shipped in a moisture barrier bag and labeled as moisture sensitive. Depending on which moisture sensitivity level (MSL) the components have, floor life can range from unlimited to a mandatory
Electronics Forum | Mon Sep 09 15:38:20 EDT 2013 | action_101
For the proper baking durations for msd componrnts you should follow the ipc/jedec j-std-033b standard. Just google that standard and the pdf should come up. On page 16 there is a complete table showing the temps and durations.
Electronics Forum | Fri May 05 11:10:07 EDT 2000 | John Thorup
Hello Aerin...welcome Actually you have already found a very important web site for your research. Go to the SMTnet archives and do a search. You will find a wealth of practical information. After that, go to the IPC or the JEDEC website and downlo
Electronics Forum | Wed Jun 10 22:47:17 EDT 2009 | davef
You're correct that JEDEC J-STD-033 defines baking condidtions for moisture sensitive components. Why do you want to bake assemblies after cleaning? Search the fine SMTnet Archives for threads like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Me
Electronics Forum | Tue Jul 17 00:10:32 EDT 2012 | amitsindwani
Referring to IPC/JEDEC J-STD-033B.1 section 3.3.2.2 'The amount of desiccant used, per moisture barrier bag, shall be based on the bag surface area and WVTR in order to limit the interior relative humidity in the MBB to less than 10% at 25°C.' So wha
Electronics Forum | Sun Mar 25 22:21:03 EDT 2007 | sleech
Let me explain. At 125 degrees C, the oven is above the boiling point of water. It will be vaporized and eventually be vented from the oven. However at temperatures of 90 degrees c and lower the relative humidity becomes an issue. For the life of me,
Electronics Forum | Wed May 04 04:31:44 EDT 2005 | siverts
What is the MS-level and floor life of the critical components (should be written on the MSD-bag)? What is Your climate condition in the production area (%RH, temp.)? Are you doing this inspection on every board or is it enough to do it on the first
