Electronics Forum: kgf (Page 1 of 1)

BOTTOM SIDE CHIP COMP FALLEN OFF IN WAVE SOLDER

Electronics Forum | Sun Nov 22 10:25:39 EST 2009 | rajeshwara

We are using LOCTITE 3606 HAVING torque 70 kgf.cm , but the comp fallen off in wave ...Rejection is 1 to 2 %. Plz help

Butt connector

Electronics Forum | Tue Oct 15 09:52:38 EDT 2019 | SMTA-Davandran

I seeing connector with butt (I) lead drop off after drop test conducted. the current shear force is about 3kgf. How can this problem improved.

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

Axial capacitor Pull out force

Electronics Forum | Tue Aug 21 20:52:06 EDT 2007 | davef

There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some lea

Fuji CP6 and IP3 specifications request

Electronics Forum | Tue Aug 09 11:14:28 EDT 2016 | cyber_wolf

•Rated Speed of 40,000 CPH •140 - 8mm Device Locations •14" x 18" Max PCB Size PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm Board Thickness: 0.3 to 4.0mm Component capacity Up to 140 types (8mm tape) Placing rate 0.09 sec./component - 40,

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