Electronics Forum: kme ball attach machine (Page 1 of 5)

solder ball attachment machines

Electronics Forum | Mon Nov 15 14:24:17 EST 2004 | nrocco

Im looking for equipment that can attach solder balls between the size 15-25 mils to the leads of a land grid array. There is also the posibility of attaching balls before leads are inserted into the socket. This is a little differant than attaching

solder ball attachment machines

Electronics Forum | Mon Nov 15 14:26:11 EST 2004 | nrocco

also the balls need to be lead free, just to make it more interesting.

solder ball attachment machines

Electronics Forum | Mon Nov 15 15:27:48 EST 2004 | davef

In creating your solder balls, consider printing or dispensing solder paste on the pads of the LGA and then reflowing the paste.

solder ball attachment machines

Electronics Forum | Tue Nov 23 08:49:08 EST 2004 | zanolli

Please contact me offline and I can discuss methods of attaching solder balls to stamped metals contacts �on the fly� while the contacts are still continuously oriented or in reel form. Regards Jim Zanolli Teka Interconnection Systems Phone: 401-785

solder ball attachment machines

Electronics Forum | Thu Nov 18 09:25:42 EST 2004 | pjc

Vanguard is a ball placement machine. They are out on Long Island NY and manufactured by White Eagle Engineering. The contact person is Pete Heinzl 520-791-0239, pheinzl@whiteeagleeng.com

DC-DC Converter with solder ball package

Electronics Forum | Fri May 26 21:25:52 EDT 2006 | mika

Yes we do place "big and heavy" SMT DC/DC:s on most of our board's. Please tell us what brand it is or at least what the package look like?!? For instance we place a different numbers of "heavy" DC/DC converters (40x20mm & 45x25mm) that has the pick-

Die placement with MPA-G3 pick and place

Electronics Forum | Thu Jun 06 08:16:13 EDT 2002 | caldon

Jim- Sorry I can not offer advice on the Panasonic machine but do want to shed light on the Die and waffle pack issue. Take note that if the Die are loose in the pockets the balls or terminations could be damaged. The thin layer that the ball is atta

Re: Ball Deformation Inspection for CSP devices

Electronics Forum | Wed Jun 02 11:29:39 EDT 1999 | John O'Brien

| | I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera ca

gold wire bonding

Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris

The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi

Re: SOLDER BALL UNDER THE PCB AFTER REFLOW SOLDERING

Electronics Forum | Fri Oct 02 01:21:08 EDT 1998 | Mike Cox

Kyung Sam, | | Justin is correct, there is definately either a board design problem or the PCB maker issue. Obviously there are many mixed technology boards built in the world so I would lean towards a design issue as the root cause. Should you or

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