Electronics Forum | Wed Jul 03 14:08:10 EDT 2002 | gbriceno
I' designing a PCB with SMD components to optimize the land patterns for wave soldering. I find that the IPC-SM-782 land patterns are not robust enough for wave soldering, yielding ramdom skips and bridges. This PCB will also give me insight on sha
Electronics Forum | Wed Feb 28 17:42:43 EST 2001 | lileubie
I've used round and optimized ovate pads for the majority of boards used in prior companies. Study after study has proven excellent reliability. Why your sample has both apertures, I could only guess that your customer is testing both. Have you e
Electronics Forum | Thu Jan 05 01:44:22 EST 2017 | soldertraining
In modern education, almost every Electronic Engineer must design a PCB. Once you get to know PCB design tools and functions, then creating a layout will become easier. Today, we find 0.4 mm pitch BGAs in every smartphone, and 0.3 mm ultra-fine pitch
Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
Electronics Forum | Wed Jun 16 12:43:10 EDT 1999 | Brian
Cliff, I'm sending you by e-mail (don't think I can attach a graphics file here) the doc proof that the problem lies between Atlanta and Ft Lauderdale. This was an attempt to trace your routing. From Cyprus, it crossed the Atlantic by West Orange. U
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
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