Electronics Forum: land patterns bga 224 (Page 1 of 3)

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr

Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads

0.5 mm pitch BGA

Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc

Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components

BGA and Land Patterns

Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos

What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank

BGA lands and ICT

Electronics Forum | Wed Mar 20 15:18:09 EST 2002 | angiewest

You may want to check out IPC-SM-782 "Surface Mount Design and Land Pattern Standard" http://www.ipc.org Good Luck

Re: BGA and Land Patterns

Electronics Forum | Tue Apr 27 13:00:05 EDT 1999 | Justin Medernach

| What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | Thanks, | | Frank | Frank, Refer to the device manufacturers. they are going to have a recomme

type 3 vs type 4 paste

Electronics Forum | Thu Nov 07 10:59:11 EST 2002 | pjc

IPC-7525 "Stencil Design Guidelines" is a good reference document to have. Here are notes from a Tessera, (a major mBGA mfg.), study- "Application Note Solder Stencil Requirement for mBGA" The stencil aperture is to be square, equal in size to the l

Xray

Electronics Forum | Sat Dec 15 10:01:59 EST 2001 | davef

USE OF XRAY Xray is not used for testing BGA. Xray is an inspection tool, similar to a microscope. Check the fine SMTnet OnBoard Forum. Gil Zwieg from Glennbrook made some good points. Additionally, search the fine SMTnet Archives, where there�s

Re: BGA and Land Patterns

Electronics Forum | Wed Apr 28 14:41:45 EDT 1999 | Bob Willis

| | What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | | | Thanks, | | | | Frank | | | Frank, | Refer to the device manufacturers. they are going t

Xray

Electronics Forum | Fri Dec 14 08:31:51 EST 2001 | PeteC

For a reference check out IPC-SM-782A Amendment 2 "Surface Mount Design and Land Pattern Standard" BGA. It can be found at http://www.ipc.org

Re: BGA PAD REDUCTION

Electronics Forum | Sat Jul 31 13:35:14 EDT 1999 | Miguel Mariscal

| Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | If you know what component your'e going to u

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