Electronics Forum | Thu Sep 10 15:06:11 EDT 2009 | dyoungquist
My guess is that he is talking about the gold plated pads not fully wetting with solder. We have seen this on some of our ENIG boards with the gold still showing at the far corners of the rectangular pads. Not knowing if this is hand soldering or p
Electronics Forum | Wed Apr 13 12:10:47 EDT 2022 | winston_one
Hello! We have a strange effect. Some pads of big trough-hole DDR slot just dessapear. Initialy it was soldered with selective soldering process (leaded, 290 degrees, ImSn finish, very short storage). Then some connectors with poor barrel fill we hav
Electronics Forum | Mon Aug 10 12:28:17 EDT 2009 | davef
We don't know dip about your Linear Tech LGA118, but we agree with published reports that say you should have between 4800 and 7000 thou^3 of paste on the pad for a LGA. These volumes were analyzed based on volumes found successful for CGA and then e
Electronics Forum | Thu Jan 02 22:09:15 EST 2020 | Zack
Hello, Can you give more detail on LGA parts in question? is 50 mm x 50 mm is overall size of the parts? What about pad pitch and how big is the pads individually? I assume that 50x50 mm is overall size. How about the stencil opening for the LGA pad
Electronics Forum | Thu Mar 19 11:31:14 EDT 2015 | duchoang
We remove the LGA, clean the pads, "re-ball" the LGA by solder-printing it, reflow and re-install it on board as BGA. That way, we don't need to apply solder paste on board. It works !!!
Electronics Forum | Fri Jun 04 11:38:47 EDT 2021 | bangir
Hi All, Do you have any experience for LGA component rework on SRT equipment? Please share how to re-soldering the LGA component to PCB pads. Thanks
Electronics Forum | Tue Dec 19 15:36:12 EST 2006 | zanolli
Does anyone have any reliability history on using compression mount connectors, such as LGA sockets (no soldering of contacts as contact exerts spring pressure on PCB pad) to PCB�s with immersion Au or ENIG finished pads?
Electronics Forum | Wed Mar 02 05:01:41 EST 2005 | ABHI
Are your packages mounted on boar using sockets or BGA balls? LGA's are usually no issue and are simple compared to BGA. No issue on missing balls or ball drop issues. However, LGA's need quite a bit of mounting / holding pressures during test and mo
Electronics Forum | Fri Mar 30 23:35:43 EDT 2007 | mika
Question: Does this formula apply even for the small LGA:s like LGA36 6.5 x 3.5 x 0.6 mm pad size 0.35mm pitch 0.60mm? We use a 0.13 mm stencil thichess beacuse on the same board there is some P.I.P comps. The board dimensions is 35 x 50 mm on a pane
Electronics Forum | Tue Apr 01 09:36:25 EST 2003 | davef
You're correct. There is no way you can aquous clean under a low stand-off part like a LGA. Your approach seems reasonable, given your constraints. [As long as your customer is paying, what the hey!!! Give 'em what they want.] Consider joining t
