Electronics Forum | Tue Oct 30 14:39:41 EST 2001 | markhoch
Has anybody else out there had problems with SMT connectors with plastic locating pins lifting up during the reflow process? We've had several instances with several differant types of SMT connectors lifting up during the reflow process. We've even g
Electronics Forum | Thu Nov 04 19:55:49 EDT 2010 | eadthem
The best method i have for the few lifted/bent lead issues we have is i use a ic/bridge inspector with all its default options to check for bridges and solder at the tip. then i add a solder inspector but this time accrost all pins at the downslope o
Electronics Forum | Fri May 28 07:37:52 EDT 1999 | Steve Cheung
Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect 144 p
Electronics Forum | Fri May 28 16:30:39 EDT 1999 | JohnW
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Sun May 30 08:50:42 EDT 1999 | Dave F
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Sun Mar 13 23:30:59 EST 2005 | VS
After reflow AOI makes sense because it has the highest coverage of the defects. Problems like tombstone, lifted pins, open solder joints, some shorts and insufficient solder you will not find before oven. I would also not agree with the statement th
Electronics Forum | Mon Oct 29 16:34:02 EST 2001 | patcope1
I have a custom connector that tends to lift during reflow. The PCB retention tabs and pins are lifting off of the pads on the board and the solder is forming underneath the pads, with no heel or toe filet. Is there anyone out there that can help if
Electronics Forum | Fri Oct 30 08:12:10 EDT 2009 | rajeshwara
HI NEMO , I HAVE GOOD EXPERIENCE OF PDT AOI SUPPLIED BY SAMSUNG TECHWIN IT IS CAPABLE OF HANDLE SUCH THING AT GREAT LEVEL ,JUST NEED GOOD UNDERSTANDING OF PROGRAMMING AND DEBUGGING , WE ACHIEVED 100 PPM WITH HELP OF IT , U GO FOR 5 CAMERA WHICH WIL
Electronics Forum | Fri Aug 04 10:42:26 EDT 2000 | James
So Darby do you use your clamshell printers in production, if so what volume? Do you use a snap off distance? With our current printers the board is held with tooling pins, when the stencil is lifted the board has a tendency to stick and lift to so
Electronics Forum | Sun Sep 09 22:57:05 EDT 2007 | syedsmt
Dear Members, Sorry,I might have not made myself clear on this issue and creating some confusion.Actually the problem faced is during the DIP Soldering process whereby one of the connector(IDE Pin) solder is cracked and lifted from the pattern.Visual
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