Electronics Forum: manue (Page 1 of 1)

Re: Component Identity Help!

Electronics Forum | Fri Jan 12 10:25:03 EST 2001 | John Litva

Thanks for the info Patric...! Using that I found the resonator on the Manu's website. Armed with that and info I recvd on the PIC, I jumpered across the resonator and the board now functions. We'll be testing tonight with the Heli and see how it

Design and manu.

Electronics Forum | Thu May 26 00:42:19 EDT 2005 | nicholas2005

Ok, I just need someone to give me some feed back on a few questions I have. If anyone could help me that would be great. Example: take a Fuji CP-4 feeder for instance! If I machine my own, place my own parts on it, and place my own company name, and

Re: Prototype Surface Mount Equipment

Electronics Forum | Tue Jun 23 11:03:15 EDT 1998 | Russ Miculich

Greg, In looking at your budget. The best place may be to contact Mancorp and see if they can outfit your needs. I believe their starter kit is about $12 to $15K for printer, p&p, and oven. This would probably be a good place to start. Just so yo

Need Help Operating CSM84VZ

Electronics Forum | Thu Jan 06 10:49:18 EST 2011 | ercdave1

Thank you guys for the help. Tom, i got the manual and as far as i can tell there is a lot of reading i need to do. Also got the MCH file but i do not have any idea as of how to imput to the machine. i will read the manual hopefully some of my ques

One Piece Flow ( high mix low volume)

Electronics Forum | Thu Nov 03 10:11:20 EDT 2011 | remullis

I am being asked by management to setup one piece flow through every operation. We have SMT,DIP,RAD,AX,MANU,WAVE, Quite a bit of hand soldering, Post Inspection, AOI,CLEANING,BARCODING then out the door. We have rougly 60 different products with most

Can you wave solder this part

Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef

National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun

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