Electronics Forum | Wed Aug 11 00:57:15 EDT 2004 | vinitverma
Hello, I may be able to help you on CSM84 series. Please write in details the problem that you are facing. Are you able to start the machine? If not, what is the serial no. and year of manufacturing of the machine? What is the message that you get w
Electronics Forum | Fri Oct 22 11:04:29 EDT 2004 | Simon UK
I have experienced this same problem with CECC Type caps, in all sizes. One cause, which may have not been explored is the component may hav been cracked before you placed it 1 in 300? Hmm..I did this on our products that were showning atleast 5 per
Electronics Forum | Thu Aug 19 12:01:26 EDT 2004 | erhard
We want to get a process running to print paste with a thicker plastic stencil with some room left underneath for preassembled components. I know DEK offers these stencils but since we are using an MPM printer they don't want to sell to us stencils f
Electronics Forum | Wed Sep 08 20:48:36 EDT 2004 | peter016
Hi Rob, I guess the ratio between chipmounter and GSM is very much depending on the chip to ICs ratio. This is product dependent. We use 2 HS50 to 2 GSMII, 5 S20 to 2 GSMII, 3 Sanyos to 2 GSMII, and 2 CP6 to 2 GSMII. Are these ideal ratios ? Lean Ma
Electronics Forum | Wed Sep 14 13:09:59 EDT 2005 | EddieW
Well said KEN! Frank, you will not find much out there for free advice on lead-free from anyone besides manufactures who supply equipment and material for lead-free and all they will tell you is to use their stuff cause its the best. The companies
Electronics Forum | Fri Sep 24 13:38:16 EDT 2004 | Nick Prince
The re-use of any component has commercial implications as weel. If you check the data sheet for the component in question you will find the reflow profile, usually there will be a "Max No of Reflows". I have never seen this number higher than 2. If
Electronics Forum | Thu Sep 02 15:51:15 EDT 2004 | cburress
All: IPC does not directly state any criteria for physical characteristics of what a filled via should look like when embedded within a surface mount component's pad. I am using several of these in my design, and have received PCBs that exhibi
Electronics Forum | Fri Sep 03 11:45:15 EDT 2004 | rlackey
Hi Ken, I know this doesn't help in the immediate timescale, but isn't avoidance the best form? can you trace the cracking to a process issue (Solder profile, shock damage, handling damage, probe/ATE damage)or a chip cap manufacturing fault? I can'
Electronics Forum | Tue Sep 07 15:11:35 EDT 2004 | Dreamsniper
It's been a while since BGA usage become widespread. Ton's of articles had been written with regards to design, processing, techniques, inspection etc...but it seems like there's still no hard ground for standards and IPC 7095 doesn't cover everythin
Electronics Forum | Wed Sep 08 06:22:51 EDT 2004 | Tore
Hi all, There seems to be a problem with the major component vendors/manufacturer everywhere; to supply lead free dummy/daisy chain components, in particular BGA-devices, within a reasonable time (not a big fan of 8-12 weeks). If they got them at all
