Electronics Forum | Sat Jun 16 00:45:50 EDT 2007 | rzagwyn
PLEASE HELP ME WITH THE TERM THROWN MATERIAL AND WHAT IS THE STANDARD PROCESSES RELATED TO IT.
Electronics Forum | Wed Mar 10 16:18:29 EST 1999 | greg cronin
I am looking for a supplier for bare fr4 material. I use the fr4 for fixtures and my supply has run out. A supplier in the new england area would be the best. thank you
Electronics Forum | Fri Dec 10 01:02:36 EST 2010 | sparrow
Hello, our products are made on single-sided boards and we often have problems with receiving too warped PCBs from our suppliers. Can anybody suggest a good laminate or the most important properties of the material so we could specify it when we orde
Electronics Forum | Mon Dec 13 07:34:10 EST 2010 | davef
Here's a link to a recent thread on warpage http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=63244
Electronics Forum | Tue Dec 14 09:59:13 EST 1999 | mike d
Hello folks, Does anyone have any dealings with screen printable masking material? Thanks, Mike
Electronics Forum | Tue Jan 25 09:04:02 EST 2005 | Indy
Are you soldering to polymide material or nickel tin ?
Electronics Forum | Sun Mar 26 19:54:47 EST 2000 | Marc
when would one use a difunctional base laminate material as a possed to a tetrafunctional base material? What possible problems are associated with each?
Electronics Forum | Fri Jan 21 13:29:35 EST 2005 | vinod
Hi Friends, I had a PCB with polymide material with nickle tin plating on it. I had real hard time to do hand solder. I am asking help if any one have any experience with polymide material.
Electronics Forum | Wed Sep 30 11:42:45 EDT 1998 | Ray N. Lopez Mata
I am looking for a material which may be used to deflect heat / shield a component from heat. The component would be exposed to the heat during the card reflow process. I would need the material to be of such a nature that I could form a cover by
Electronics Forum | Wed Sep 30 12:32:15 EDT 1998 | CHAD HAIMA
I am looking for a material which may be used to deflect heat / shield a component from heat. The component would be exposed to the heat during the card reflow process. | | I would need the material to be of such a nature that I could form a cov
