Electronics Forum | Fri Jun 25 16:18:26 EDT 2004 | waveroom
For what its worth. Even though you are potting the boards. If for whatever reason flux residue (OA) was left on the board prior to potting this flux could migrate and cause embrittlement problems with the solder joint. I would definately inspect for
Electronics Forum | Thu Nov 07 15:06:11 EST 2013 | hegemon
1st X-Ray looks pretty good. One instance of what looks like solder migration in the lower left quadrant. 2nd X-Ray shows a number of locations where the solder has migrated into the vias, shown by the small dark circles between the main spheres.
Electronics Forum | Tue Mar 18 17:23:40 EDT 2008 | dkntb
Any member in here has experienced of copper migration from BGA's substrate to PWB during eutectic soldering reflow process, which resulted in brittle solder joints??? We have one customer notified us that our PBGA with DSOP substrate having copper m
Electronics Forum | Tue Jun 29 18:35:59 EDT 1999 | JohnW
| | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | Leaching. Dissolution of a metal coating into liquid solder. Nickel ba
Electronics Forum | Thu May 05 11:55:52 EDT 2005 | jimmiem
Was it determined what caused the flux migration?
Electronics Forum | Sun Aug 13 08:54:19 EDT 2006 | davef
electrochemical migration What flux are you using?
Electronics Forum | Thu Dec 19 02:16:19 EST 2019 | sssamw
if use more aggressive paste,be careful risk of electro-chemical migration
Electronics Forum | Mon Dec 04 20:57:09 EST 2006 | callckq
Hello, I did EDX on BGA just to find out copper wt% at the package- ball interface. Is wt% ranging from 20 to 32 considered as normal?? As far as I know lead free BGA and solder paste just have little copper..Where is this excess copper come from
Electronics Forum | Fri Dec 03 04:20:18 EST 2010 | grahamcooper22
Hi In Dec 2008 the IPC J STD 004 was updated to 004B, and I am wondering what the new test conditions are for testing flux Surface Insulation Resistance and Electro Migration Potential within the new spec. I am looking for the recommended test temp
Electronics Forum | Wed Jun 30 11:09:24 EDT 1999 | John Thorup
| | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | Leaching. Dissolution of a metal coating into liquid solder.
