Electronics Forum | Tue Nov 08 20:58:49 EST 2005 | davef
We buy humidity as a potential cause of solder balls, but we're not biting on dewetting. Something else is causing that. Questions are: * What's the temperature and RH of your SMT production area? * What kind of paste are you using? [Some water was
Electronics Forum | Wed Nov 09 10:25:09 EST 2005 | Amol
where in india are you laxman? and what kind of manufacturing are you involved in?
Electronics Forum | Mon Nov 07 07:43:56 EST 2005 | pjc
No way I've ever heard to remove mositure from solderpaste. What is the R.H. in your factory? Are you in the tropics? Does you printer have an enclosed print area like on an automatic machine, or is it semi-automatic and exposed to the room air?
Electronics Forum | Tue Nov 08 20:51:41 EST 2005 | davef
Pete, the SF Bay Area gets very muggy this time of the year. Look here http://www.weather.com/weather/local/94110?lswe=94110&lwsa=WeatherLocalUndeclared&from=whatwhere
Electronics Forum | Wed Nov 09 07:46:58 EST 2005 | chunks
Hi Herb, Lexman, try a different paste to eliminate that question mark. Unless you're stuck with Kester, it's worth a couple hours of your time. I know of a couple SMT plants that run 40% to 50% humidity without any problems.
Electronics Forum | Wed Nov 09 22:03:33 EST 2005 | laxman
Hi Amol, We are in South part of India.basically we are basically EMS providercatering to the needs of our Overseas customer and partiallytodomestic market. We are also providing complete manufacturing solutions including cable harness, enclosure as
Electronics Forum | Mon Nov 07 08:27:56 EST 2005 | chunks
It could be you are drying out your solder paste. Most flux formulations are alcohol based and after a few hours can dry out. This can can lead to dewetting and solder balling as well. Especially if you do not homeplate your R's and C's. A simple
Electronics Forum | Wed Nov 09 02:24:49 EST 2005 | laxman
Hi Dave, Normally in our country (India) during rainy season the temperature will be 25to 30 �C and RH of 50 to 60%. The reason behind this humidity issue is that recently we have moved to our new facility with centralised air conditioner with Chill
Electronics Forum | Mon Nov 07 06:16:59 EST 2005 | laxman
Hi, We have faced the solderability issue (Dewetting and solder balls)in all the Boards after reflow.When we found this issue we discarded the old paste and started using the new paste then for some hours the solderability found to be O.K. After so
Electronics Forum | Mon Dec 31 09:00:06 EST 2001 | davef
Baking before assembly does nothing good. It: * Increases costs. * Adds steps to the process and makes scheduling more cumbersome. * Increases the amount corrosion on solderable surfaces. We used to bake to remove the moisture from boards that caus
