Electronics Forum: moisture issues with ic (Page 1 of 3)

Universal GSM1 with Shuttle

Electronics Forum | Fri Sep 23 06:42:08 EDT 2005 | lloyd

The only issues I have had in the past with the shuttle are 1. The transport conveyor into the machine was not aligned correctly causing pickup issue from the belt. 2. Operators not correctly loading parts in trays or updating the qty's, this meant

Re: Popcorn effect with PBGA

Electronics Forum | Wed Apr 05 08:51:25 EDT 2000 | Wolfgang Busko

Emmanuel: Popcorn effect is mostly caused by entrapped moisture in the components package material. Plastic ICs are known for absorbing and storing moisture when exposed to normal factory conditions. They should be stored in an moisture reduced envir

BGA underfill necessary with conformal coat?

Electronics Forum | Tue Apr 02 11:21:46 EST 2002 | BTaylor

davef I assume this question is for my reply and me. We used a dexter\hysol underfill and a Camalot 5700 to dispense.Single line technique next to a small IC with 14 bumps around the perimeter.The conformal coating was applied with a small brush aro

Solder beading with PCB from different fab

Electronics Forum | Fri Apr 01 02:56:18 EDT 2011 | grahamcooper22

the cause could be moisture in your pcbs. To check it...pass some bare pcbs through your reflow oven (this is a simple way of drying them out a bit), then paste and place and reflow as normal....if solder beads disappear then the pcbs have too much m

Problems with Maxim TQFN 38 pin part

Electronics Forum | Fri Mar 16 10:43:31 EDT 2007 | kennyg

A quick experiment idea: Try reflowing a bare board prior to assembly. Perhaps your boards have moisture and outgassing issues.

0402 chip capacitor with solder spatter

Electronics Forum | Mon Jul 16 10:44:29 EDT 2007 | Jacky

Hi All, Recently, we encountered strange defect at our SMT line. We can see solder ball spatter around at one of the component pad. This lead to insufficient solder defect at 1 side of the component. The other side of the component look good(Meet

If we could bake the Board with OSP finish?

Electronics Forum | Thu Aug 05 16:15:18 EDT 2004 | pjc

Are you considering baking due to moisture exposure? Not all OSPs are created equal. I would check with your PWB fabricator about dry times and effects on their OSP finish. After you get it, I'd still try just one PWB for bake-dry out and check solde

Baking oven be kept off with MSDs inside

Electronics Forum | Thu Sep 06 10:04:26 EDT 2012 | kahrpr

We keep our MSDs in a dry cabinet. We only bake if we suspect we have a moisture issue usually PCBs or large BGAs and then it goes back in the dry cabinet.

Difference Gold Plating electrolytic and ENIG with on BGA

Electronics Forum | Thu Apr 07 09:04:19 EDT 2011 | mosborne1

First of all you need a new board house. You should quote us http://www.americancircuits.com. This really looks like a poor drilling operation with the blow holes. Blow holes are usually caused by two main problems. Improper drilling and/or moisture.

100nF 0805 ceramic cap with 25 Ohm resistance? Why?

Electronics Forum | Tue Jun 29 14:55:22 EDT 2010 | rgduval

For the capacitors that Yageo analyzed... Were they taken out at representative points in the process?? ie. were samples taken from pre-assembly, pre-ICT, post-conformal coat, post-final test? You note that the parts 'seem' to be ok up to ICT. And

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