Electronics Forum | Mon Jun 17 21:31:23 EDT 2002 | davef
Most of our discussions here on SMTnet have focused on underfills. With transfer molding, voiding near the die, wire bonds, or leads contribute to more failures than others. Try: * Tim Chen, Cookson Semiconductor 800-223-9057 * Ron Molnar, Abpac In
Electronics Forum | Thu Sep 24 18:57:03 EDT 2009 | davef
From "siliconfareast.com": Basic Die Cracking FA Flow 1) Failure Information/Device and Lot History Review. Understand the customer's description of the failure, i.e., the failure mode, where it was encountered, what conditions the sample was subject
Electronics Forum | Thu Oct 30 14:46:33 EDT 2008 | rgduval
I've used DBA in the past. It's not a bad MRP software for the price. Though, your mileage may vary. We were using an older version of it at my last company, and there was no desire to upgrade. From a manufacturing standpoint (bill of material co
Electronics Forum | Wed May 19 19:46:41 EDT 2010 | jry74
I am experiencing sporatic de-wettting issues, so I have been thinking about ways to clean fully assembled circuit boards that have open switches, contacts, etc. I also suspect that that plastic bodied components have residual silicone mold release
Electronics Forum | Thu Aug 12 00:02:29 EDT 1999 | dean
| We currently have 32 LEDs per board and are looking to change the LED from a gull wing package to another package. (possibly a chip type package). I have heard that some cases and LEDs do not like reflow. This part is not cost effective to have to
Electronics Forum | Fri Oct 01 06:02:43 EDT 1999 | Bach Huss
Hi, We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision centering. The sy
Electronics Forum | Fri Aug 03 12:24:14 EDT 2001 | hinerman
I can only describe how the Grid Lok handles component variability. The compliant caps have an annular ring that is very soft and can mold to different shapes. If a component shows up where there was no component before, the outside of the cap bend
Electronics Forum | Tue Nov 18 09:54:49 EST 2014 | gregp
Hi Adam, Good question. I know I am seeking a lot of details. Here's the deal. Five years ago I acquired the assets of Contact Systems. Since then I have been re-manufacturing the CS-400E machine which if you are not familiar with is a light guid
Electronics Forum | Wed Jun 03 07:13:27 EDT 1998 | Tom Tellinghuisen
| We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not al
Electronics Forum | Fri Oct 01 06:45:36 EDT 1999 | JAX
| Hi, | | We are running 0402 component on the TCM1000 and we find that teher will be missalignment on 0402 Capositor. We have identified that the missalignment is caused by the wrong information from the vision system while doing vision centering.
