Electronics Forum: msl bake time thickness (Page 1 of 8)

Baking parts of mixed thickness / time in oven requirements

Electronics Forum | Thu Sep 19 15:39:16 EDT 2019 | qanalyst1

When baking parts at 90C that require 15 hours bake time with parts that require 25 hours bake time, is it acceptable to open the oven and remove the former (15 hours) parts and then continue the 25 hours cycle for the remainder of the parts in the o

Baking parts of mixed thickness / time in oven requirements

Electronics Forum | Fri Sep 20 16:41:01 EDT 2019 | qanalyst1

Thank you for the response, yes, the oven is vented. I guess I am concerned for parts with a thinner package body, so I wasn't wanting to leave them in for too long past the recommended bake times.

Baking parts of mixed thickness / time in oven requirements

Electronics Forum | Fri Sep 20 17:45:50 EDT 2019 | deanm

It won’t hurt’em if under 96 hrs.

Baking parts of mixed thickness / time in oven requirements

Electronics Forum | Fri Sep 20 17:47:49 EDT 2019 | qanalyst1

Very good. Thanks.

Baking parts of mixed thickness / time in oven requirements

Electronics Forum | Thu Sep 19 21:31:37 EDT 2019 | deanm

Briefly opening the door probably won’t affect anything significantly. If in doubt, add an extra hour to the bake time. A better approach might be to keep both parts in the oven for 25 hours. You have up to 96 hours before oxidation becomes an issue.

Alternatives to device bake out

Electronics Forum | Fri Feb 19 06:45:29 EST 1999 | Charles Stringer

Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. I have come accross dry nitrogen storage chambers

Re: Alternatives to device bake out

Electronics Forum | Mon Feb 22 13:15:43 EST 1999 | Dave F

| Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. | I have come accross dry nitrogen storage cham

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef

There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si

Re: Alternatives to device bake out

Electronics Forum | Mon Feb 22 12:20:51 EST 1999 | Dave F

| Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. | I have come accross dry nitrogen storage cham

Baking time for PCBA rework

Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette

Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r

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