Electronics Forum | Fri Apr 21 08:07:10 EDT 2006 | amol_kane
I struggled with the std too, when trying to justify the need for a desiccant cabinet. according to my interpretation: 1. the components are baked at 125 or 150 dec C within 24 hrs of manufacture (this is MET) and sealed in the MBBs at the component
Electronics Forum | Thu Jun 28 09:38:14 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Thu Jun 28 09:38:20 EDT 2012 | 14367
PSMN130-200D MOSFET TRANSISTOR D2PAK - failure of some parts led to investigation, oxidization or surface contamination was noticed on remaining parts. The surface contamination could be removed when fingernail was drawn over the bottom terminating s
Electronics Forum | Mon Jul 23 08:35:33 EDT 2012 | grahamcooper22
The lower the RH in the MBB the better for all moisture sensitive devices. Maintaining less then 5% will mean no parts of between 2a-5a MSL will need drying before use. The calculation uses 10% because it is a sensible amount of desiccant to use base
Electronics Forum | Mon Nov 20 09:44:07 EST 2006 | Amol Kane
you can reference JESD97 for labeling LF components, also. i have sent a similar letter to our suppliers and am fielding questions ranging from, what is a MBB to why such strict packaging requirements. i was surprised to know that the requirements
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