Electronics Forum | Mon Nov 05 20:34:03 EST 2001 | davef
What�s the problem? There area many heat related failure mechanisms in bare boards. You can damage boards with heat several ways. A couple favorites [Don�t try this at home. Perform on a closed track by professional solders only.] are: * Put a
Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Electronics Forum | Sat Oct 02 20:19:19 EDT 1999 | John Dwinell
| | I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Ir
Electronics Forum | Wed Sep 12 21:13:17 EDT 2001 | davef
Just because I�m not currently ranting about nuking Kabul, Tehran, Baghdad, and Algiers or laying a coat of jellied gasoline on those little punks celebrating with their candy in Palistine; that doesn�t mean my shock and grief will not turn to anger.
Electronics Forum | Tue Jul 30 07:29:06 EDT 2013 | scotceltic
We are currently experiencing thermal shock failure on a BGA package. We are currently looking at improvements to improve the thermal shock properties by using underfilm. I have seen some studies out there that use this process to improve drop test
Electronics Forum | Wed Sep 20 15:51:19 EDT 2000 | John
We are considering retrofitting our Vectra wave soldering machine with a hot air knife. I've run our problem board on a machine with this option and it does seem to work; however, there is a concern of component failure due to thermal shock. Is thi
Electronics Forum | Mon Jun 30 10:52:36 EDT 2003 | Bob
Suggest you ask vendor for a failure analysis. Ceramic chips have specific signatures for mechanical or thermal shock cracking. The vast majority of failures are due to mechanical flex. Depanelization and secondary operations such as hand insertion
Electronics Forum | Fri Jul 30 09:59:10 EDT 2004 | Steve
Excessive Time above Liquidus will cause a solder joint to become extremely brittle. Any shock or stress to the joint can lead to a failure.
Electronics Forum | Tue Jun 22 08:37:52 EDT 2010 | davef
Dennis: These "terminal detach failures" probably are caused by thermal shocking of the components. * Preheat the components * Use a hot air pencil rather than a soldering iron
Electronics Forum | Wed Aug 14 18:17:32 EDT 2019 | slthomas
We are down to the last few unresolved PCBA test failures in a work order and scrambling to get them repaired and into a mechanical assembly. What we have found in quite a few of these cases are cracked 1206 MLCCs. The failed parts are all the same
