Electronics Forum | Wed Jun 20 16:03:01 EDT 2001 | Gil Zweig
The multi-layer printed circuit board manufacturers have been using x-ray inspection for many years to quality control drilling and lamination of multi-layers. Assemblers should consider using x-ray for incoming quality control from their multi-layer
Electronics Forum | Fri Nov 17 07:58:06 EST 2006 | markb
SWAG - I also forgot to mention a few things. Our delmaination was always between the large copper plane and the laminate. It is a multi-layered board, so even when the delamination appeared around components (through visual inspection), cross-sect
Electronics Forum | Tue Feb 12 10:33:45 EST 2002 | davef
IPC-4101 - Specification For Base Materials For Rigid And Multilayer Boards replaces MIL-P-13949 - Plastic Sheet, Laminated, Copper-Clad (For Printed Wiring) Taking a broader look, there are many �Obsolete MIL Document To Commercial Document� replac
Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
Electronics Forum | Fri Feb 27 10:54:38 EST 1998 | Earl Moon
REVISITING MULTILAYER DIMENSIONAL STABILITY AND LAMINATE INTEGRITY It has been said we must learn it all over again and again about every four years. I know Lee Ritchey said that to me about high speed digital circuit design. The same seems true for
Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef
Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea
Electronics Forum | Sun Aug 08 11:15:32 EDT 1999 | Earl Moon
| | Mike, | | | | Got your message and those of others concerning PCB fab supplier evaluation and qualification check lists, etc. I have a severe problem here in WI as I can hardly access the internet, and when I do it is cut off abruptly for no goo
Electronics Forum | Sat Apr 26 08:18:47 EDT 2008 | davef
Your warpage problem could be caused by change in: * Multilayer board construction (not homogeneous or unbalanced - too resin rich or poor) * Supplier process capabilities (lamination cycles) * Material selections (usually cheap and dirty), etc.
Electronics Forum | Tue Nov 17 09:24:24 EST 1998 | Earl Moon
| | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave solder
Electronics Forum | Wed Nov 18 21:58:17 EST 1998 | Dave F
| | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave sold
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