Electronics Forum | Mon Jul 10 02:34:10 EDT 2017 | sachinverma
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Electronics Forum | Fri Feb 11 09:44:01 EST 2005 | pjc
A touched-up solder joint is never as reliable as one soldered correctly by machine. Touching up adds more heat thereby increasing the thickness of the intermetalic bond. Our goal is to have the thinest intermetalic bond in our solder joints. The int
Electronics Forum | Mon Jun 26 00:22:26 EDT 2006 | YQ Deng
Through the pads of conncector(50pin) were printed full solder paste, the solder paste of about 2-5 pads follow to bottom of the connector 2-5 pins, the 2-5 pads outside of connector no any tin after reflow. Is this PCB problem? I can supply failur
Electronics Forum | Wed Jun 28 00:37:05 EDT 2006 | YQ Deng
Dear Davef, Please told me your Email address, then I send the photos to you. Thanks!
Electronics Forum | Wed Jun 28 07:44:25 EDT 2006 | davef
YQ Deng: Just click on my name next to the Lou Reed likeness in this posting.
Electronics Forum | Tue Jun 27 08:29:34 EDT 2006 | davef
It sounds like a board issue. With the current site software, you can not attach pix. You need to post the pix on another site [eg, imageshack, villagephotos, etc] and then post the link here. Or if only a couple of folk are interested, just email
Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow
Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w
Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris
I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu
Electronics Forum | Mon Mar 03 10:38:28 EST 2003 | davef
Electroplated nickel and electroplated gold is the more �traditional� finish for aluminum wire bonding. That surface was an extension of gold thermosonic wire bonding that requires a thick [50 thou min] gold surface. For years fabricators recommend
Electronics Forum | Thu Jul 03 11:36:57 EDT 2003 | Ron
Have you considered a temporary water washable solder mask. Elvaway solder mask tapes have been protecting Gold Fingers during soldering and simply wash away in a water wash process and leaves no residue.
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