Electronics Forum: nokia (Page 1 of 3)

Re: Lead Free CD ROM Winners from the Bob Willis Forum

Electronics Forum | Wed Aug 02 03:25:17 EDT 2000 | wpeng

Thank you for your email. If you have any updated information on lead-free issues, please inform me. My Address is Mrs. Weiqun Peng Electronics/Hardware Integration Nokia Research Center Itamerenkatu 11 - 13 FIN-00180 Helsinki Finland Mobile: +358

Re: about QP242

Electronics Forum | Sun Nov 21 07:01:14 EST 1999 | Michael stephens

Charley, I have worked on QP242's for 1 and 1/2 years. It is a very reliable machine but like all machines, PM's are very important. When I first got to NOKIA I wasn't familiar with the QP's. Mostly IP3's, IP2's. We are placing 16 mil pitch parts

SMT Equipment

Electronics Forum | Sun Jul 28 19:18:34 EDT 2002 | saiwong

Currently, lots of OEM or CM's have moved to China already. Solectron, Flextronic, Motorola, Nokia & Ericsson. Sooner or later, SMT assembly equipment will move their manufacturing plan to China.

cellular phone assembly

Electronics Forum | Fri Sep 24 04:11:13 EDT 2004 | rob

Hi Chics, It all depends on where you are in the world - in Europe robots were used back end (Ericsson), and usually Fujis front end (Motorola, Nokia, Ericsson). In China you're obviously not going to need the Robots.... Cheers, Rob.

removing glues chips

Electronics Forum | Mon Jun 06 07:14:21 EDT 2005 | pci

We find it impossible to remove the glued chips > like the CPU and the UEm ICs in Nokia Mobile > Phones. They are both surface mount devices and > glued with some chemicals we think. Any help is > most needed in this matter. May we know what pr

APEX Venue!!

Electronics Forum | Mon Feb 26 09:58:20 EST 2007 | Wave Master Larry

Mika Ill be in your neck of the woods around mid march. i'll be consulting with Nokia.i'll email you around that time.I look forward to sharin a gobble and drink

PCB Design Question - Hard gold or ENIG for keypad button contacts

Electronics Forum | Fri Feb 17 09:08:22 EST 2017 | davef

An interesting paper on the topic is "The evolution of surface finishes in mobile phone applications" by Claus Würtz Nielsen at Nokia Mobile Phones R&D [http://www.cicmt.org/adv_micro/papers/Nordic2004paper.pdf] The paper reported corrosion problem

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Thu Sep 05 10:15:58 EDT 2019 | SMTA-Richard

There are multiple solder alloy options and we have tested many of them in a consortium project. There also are very specific challenges associated with testing using the -40/150 C profile. This is way too complicated to discuss in a chat room. Se

Re: Lead-Free Solder Paste

Electronics Forum | Tue Jul 21 09:53:13 EDT 1998 | Steve Brown

Here at M/A-Com we use lead free solder pastes for two purposes, environment and prevention of secondary reflow in subsequent processes. The UK engineering journals all report the trends towards lead free alloys, especially in the telecommunications

Manufacturing in China, Revisited

Electronics Forum | Wed Oct 13 01:12:31 EDT 2004 | saiwong

I think forgot one most important thing. SMT is not all. In China, after the SMT process, QC, QA, casting, packing etc. It need lots of labors. I really one worker can handle 4 lines. Nokia still have two bid factory in China, Motorola has two also.

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