Electronics Forum | Mon Sep 13 22:32:41 EDT 2010 | genesan
Hi all good morning and need advice from expertise here. One of my customer complain that they have constantly issues with one of their product and ask us to do cross section.The report show there was “no wetting to the PCB copper pad” and cause the
Electronics Forum | Mon Sep 13 22:58:49 EDT 2010 | genesan
Hi all good morning and need advice from expertise here. One of my customer complain that they have constantly issues with one of their product and ask us to do cross section.The report show there was “no wetting to the PCB copper pad” and cause the
Electronics Forum | Wed Sep 15 20:59:23 EDT 2010 | genesan
hi All, Here i snap shot previous PCB(HASL) and current PCB(Immersion Silver).Base on the photo it could be PCB oxidize cause the non wetting?
Electronics Forum | Tue Sep 14 04:00:12 EDT 2010 | genesan
Hi Sir grahamcooper22, There should not a issue in stencil since i had open the aperature 1:1(one to one).Futhemore this is HASL pcb coating as now our customer had convert to immersion silver.I had do comparison between both and found HASL wetting n
Electronics Forum | Fri Sep 17 07:33:56 EDT 2010 | scottp
Based on the last few pictures in the report, the root cause is lousy HASL. In fact, you don't have HASL - you've got SnCu intermetallic. Don't mess with your reflow profile, change paste, or monkey with anything else in your process. Have the boar
Electronics Forum | Tue Sep 14 02:46:17 EDT 2010 | grahamcooper22
Hi Gani, Looking at the pictures in the report it looks as if there is a thin coating of solder on the pcb pad....but it looks like the BGA sphere was barely in contact with the pad. This could be caused by insufficient solder paste on this pad...may
Electronics Forum | Thu Apr 22 04:55:42 EDT 2004 | Richard
Have you tried using Concoat MUST II solderability tester to test on the component terminal are of good solderability. Non-wetting may occur due to oxidation or contamination on component terminal. So for immediate response to you problems is to used
Electronics Forum | Thu Apr 22 06:42:03 EDT 2004 | Chris Lampron
Adam, What is the pad finish on the flex circuit? Is this the only component that you are having problems with? (on this Flex)If this is the only problem area on the flex (assuming there is more than one component)then that would lead me towards the
Electronics Forum | Wed Apr 21 21:50:28 EDT 2004 | adam
Hi I recently having problems on the components having non wetting on the flex circuits. The profile that I am using is according to the solder paste suppiler recommended. Can anyone pls. advise? Regards
Electronics Forum | Tue Sep 14 02:12:22 EDT 2010 | genesan
Hi Sir, Thanks for reply and base on our system the same part are using for 2 model only and the problem occur on both assembly.By the way as feedback it happen on random pin of this BGA only.
