Electronics Forum: nsmd smd bga pitch (Page 1 of 5)

Re: Help with new placement equipment

Electronics Forum | Fri Oct 16 12:45:23 EDT 1998 | smd

| | | I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the machines which give you the best bang for floor space. I need a 2 machine system for placing 0402 to fine pi

Re: What's the Deal W. Philips Topaz??

Electronics Forum | Fri Jun 12 10:18:50 EDT 1998 | smd

| | | | In our continued search for another flex machine, we reconsidered Philips | | | Emerald (low Vol/high mix Mfg). We already have a CSM so it makes a little sense. Then the salesman started talking about the Topaz. The Topaz supposedly is "pra

BGA ball vs land design problem??

Electronics Forum | Thu Jun 04 20:06:30 EDT 2009 | davef

Since posting the above comment extolling the virtues of NSMD pads and disparaging SMD pads, we've learned that the points apply to all array devices, but in spite of that some designers of fine pitch [eg, 0.4, 0.5mm pitch] array devices choose SMD w

Solder mask vs non solder mask defined pads

Electronics Forum | Fri Jan 22 16:03:17 EST 2021 | SMTA-64387124

Does anyone see any issues in mixing SMD and NSMD pads within one BGA footprint. We have high current pads which we want to make SMD and the other signal pads to be NSMD

0.4 mm Pitch BGA stencil design

Electronics Forum | Mon Nov 01 10:29:13 EDT 2010 | scottp

I've searched the archives and maybe my search skills aren't up to snuff but I couldn't find much. I'm curious what people are doing for 0.4 mm pitch BGAs, assuming a type 4 paste. Pad diameter? SMD or NSMD? Stencil thickness? Aperture diameter? Us

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 13:28:31 EST 2000 | Dave F

Robert: Ah, opinions are like mothers, everyone has one. Here's mine: 1 Goto the Altera site, get a copy of "AN 114," follow it. Generally, manufacturers are closer to the requirements of their components than others are. 2 Metal showing on the b

Re: BGA SOLDER BALL to SURFACE PAD size relationship

Electronics Forum | Thu Feb 24 13:28:31 EST 2000 | Dave F

Robert: Ah, opinions are like mothers, everyone has one. Here's mine: 1 Goto the Altera site, get a copy of "AN 114," follow it. Generally, manufacturers are closer to the requirements of their components than others are. 2 Metal showing on the b

BGA ball vs land design problem??

Electronics Forum | Tue Jun 02 21:27:22 EDT 2009 | davef

We've never heard of a situtation where oversized pads caused voiding. Your supplier is correct that the pads on the board should be the same size as the pads on the interposer, but this is to improve reliability issues. Search the fine SMTnet Archi

BGA pad design

Electronics Forum | Mon Nov 30 08:39:05 EST 2015 | spoiltforchoice

http://blog.screamingcircuits.com/2010/09/smd-vs-nsmd.html such as this? Which handily also tells you what you might want to google.

solution to design challenge (ubga, NSMD pads, heavy traces)

Electronics Forum | Mon Mar 23 16:38:09 EDT 2020 | emeto

Steve, On 16mil pitch I would try 12mil diameter on 5mil stencil, unless the BGA ball size is something unexpectedly huge.

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