Electronics Forum | Fri Feb 20 12:52:08 EST 1998 | Earl Moon
I have developed a method to increase SMT circuit density up to 40%. Looking for interested PCB fabricators and designers for process improvement.
Electronics Forum | Fri Feb 20 16:37:55 EST 1998 | Lee Ritchey 3Com
| I have developed a method to increase SMT circuit density | up to 40%. Looking for interested PCB fabricators and | designers for process improvement. Earl, We are always interested and working on new designs. How can we get involved?
Electronics Forum | Fri Feb 20 16:39:51 EST 1998 | Jim Blankenhorn
| I have developed a method to increase SMT circuit density | up to 40%. Looking for interested PCB fabricators and | designers for process improvement. Tell us more. How can it be done and what does it take from a design level. What about solder dra
Electronics Forum | Fri Feb 20 16:34:41 EST 1998 | Jim Humecky Amdahl Corp
| I have developed a method to increase SMT circuit density | up to 40%. Looking for interested PCB fabricators and | designers for process improvement. Earl, What are you doing now. What you're suggesting can't be done without trickery. We've been d
Electronics Forum | Wed Aug 02 15:22:10 EDT 2006 | solderiron
Good luck finding used. Ersa is top quality but you pay for it. The IR from Ersa is a medium wavelength thus heating is consistent across the board despite different component densities and colors. PDR does not heat the same and thus you have to be m
Electronics Forum | Fri Feb 17 12:22:50 EST 2012 | joeln
I am planning a PCB design for automated assembly of all components, SMT. I have been told that the industry standard used at the assembly house is something called "88", and that the assembly house can do better "55" or even "44". I’m not sure if
Electronics Forum | Sat Feb 18 09:20:09 EST 2012 | davef
The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedize
Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben
I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i
Electronics Forum | Mon Mar 21 12:02:09 EST 2005 | Rob
Hi Colin, Are you using the 1206 package with 4 elements or one of the higher density smaller packages? With the first type you can get them in both Convex or Concave terminations, with most of the solderability problems associated with using the C
Electronics Forum | Thu Aug 15 03:23:05 EDT 2019 | sssamw
It depends your product application and requirement. If high level, 100ppm required, or even 2000ppm is also ok. There should have sensor detecting O2 ppm inside reflow.
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