Electronics Forum: osp bga (Page 1 of 6)

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Wed Jul 08 16:28:25 EDT 2020 | duchoang

OSP board finish is the issue. With OSP microBGA board, we need to have enough paste (enough flux) on pads (small pads on BGA), also we need to have strong, more activate flux to get rid of Preservative layer on top of pads. In this case, the OSP did

Electroless Gold

Electronics Forum | Fri Aug 11 14:50:35 EDT 2000 | Doug Philbrick

Any Motorlla Guru's out ther know, or can say, if Mot is mandating a change away from Gold / Nickel and going to OSP where BGA are involved?

What is the best way to remove OSP coatings.

Electronics Forum | Mon Sep 10 23:13:08 EDT 2007 | weehn

hi, i'm from the semicon (BGA assembly). Could you advice what is the best method / procedure to remove OSP coatings from pads of the BGA substrates. thanks Wee

SOLDER SHORT DUE TO VOID IN BGA

Electronics Forum | Wed Jul 08 02:50:30 EDT 2020 | rsatmech

Hi DucHoang, Thanks for the response. I will share the images. We are using OSP boards and issue is not at particular BGA. Can you suggest me any methods to identify the pad contamination.

OSP PCB Plating

Electronics Forum | Thu Jul 17 20:20:21 EDT 2014 | mac5

Hi June, The biggest issue with an OSP finish is as soon as the PCB sees a heat cycle (reflow or wave) the finish will begin to degrade. If you have a single sided SMT assembly with THT components installed downstream it works pretty good. But a dou

BGA relow without solder paste?

Electronics Forum | Wed Sep 21 16:25:43 EDT 2005 | GS

IPC-7525 tells you how to make stencil apertures for BGA IPC-7095 tells you how much should be the paste volume in order to get a reliable BGA solder joint. How are your PCB finisced? (HASL, ENIG, OSP, etc?) In case of not HASL, it could be necessa

Re: Special PCB finishing require for BGAs ??

Electronics Forum | Tue Mar 24 09:50:45 EST 1998 | Justin Medernach

| Do I need to specify any type of special | finishing to my PCB manufacturer when having | boards fabbed that contain BGA footprints ??? | Thanks, | Stuart No special finish is required. I have assembled boards with BGA population that had HASL,

What is the best way to remove OSP coatings.

Electronics Forum | Tue Sep 11 22:52:18 EDT 2007 | davef

Here are some options for removing OSP coatings from pads of the BGA substrates. * Leave the substrates in storage for 13-14 months. Shelf life of OSP coating is ~12 months, depending on the product. * Wash the substrates in your aqueous washer. Ea

If Not Gold Then What

Electronics Forum | Tue Aug 15 16:57:54 EDT 2000 | Doug Philbrick

In many threads here I have read and talked about Electroless Gold problems and have experienced my own problems with it. Love to hear what others are doing as a replacement. Is it Electroless tin, is it osp or is HASL good enough for .031 pitch BGA

Re: BGA step by step

Electronics Forum | Fri Sep 24 12:37:13 EDT 1999 | Terry Burnette

.032" pitch, and OSP copper pads on boards with devices that have

  1 2 3 4 5 6 Next

osp bga searches for Companies, Equipment, Machines, Suppliers & Information

IPC Training & Certification - Blackfox

Component Placement 101 Training Course
Circuit Board, PCB Assembly & electronics manufacturing service provider

Software for SMT placement & AOI - Free Download.
Win Source Online Electronic parts

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Gordon Brothers October 2-30, 2024 Auction

World's Best Reflow Oven Customizable for Unique Applications